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FREESCALE[Freescale Semiconductor, Inc]
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| Part No. |
MC13201
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| OCR Text |
...rformed based upon the baseband energy integrated over a specific time interval. The digital backend performs Differential Chip Detection (D...802.15.4 Standard requirements. Figure 5 shows energy detection/LQI reported level versus input powe... |
| Description |
2.4 GHz Low Power Transceiver for the IEEE 802.15.4 Standard
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| File Size |
231.37K /
26 Page |
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Download Datasheet
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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
FMS2017 FMS2017-000-WP FMS2017-000-EB FMS2017-000-FF FMS2017-000-GP
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| OCR Text |
...esults for 25m wire. Ultrasonic energy shall be kept to a minimum. For this bonding technique, stage temperature should not be raised above 200C and bond force should not be raised above 60g. Thermosonic wedge bonding and thermocompression ... |
| Description |
2.4GHz DPDT GaAs Single-Band WLAN Switch 砷化镓双刀双掷.4GHz单频无线局域网交换
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| File Size |
162.23K /
5 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MASW6030G
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| OCR Text |
...rams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package.
3
M/A-COM Inc. and its affiliates reserve the ri... |
| Description |
GaAs DPDT Switch DC - 6.0 GHz
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| File Size |
72.18K /
3 Page |
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it Online |
Download Datasheet |
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