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Amphenol Communications Solutions |
| Part No. |
L177HDAG26S
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock
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Official Product Page
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飞思卡尔半导体(中国)有限公司
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| Part No. |
FMC5 FMG9 FMJ1 FMQ1
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| Description |
P-Channel NexFET™ Power MOSFET 6-DSBGA -55 to 150
N-Channel NexFET™ Power MOSFET 8-SON -55 to 150
TRANSISTOR | 20V V(BR)CEO | 30MA I(C) | SOT-25
Digital Media Processor 529-FCBGA 0 to 90 晶体管| 50V五（巴西）总裁| 100mA的一（c）|采用SOT - 25
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| File Size |
181.16K /
3 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM5C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HRAG26S
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| Description |
Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell, 26 Socket, M3 Rear Nut
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2C309
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2RM5
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM5
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L77HDAG26SOL2RM8
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2RM8
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L177HDAG26SOL2
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| Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38um (15u\\) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: FMG-G26S |
| Maker: SANKEN |
| Pack: TO220F |
| Stock: Reserved |
| Unit price
for : |
|
50: $0.40 |
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100: $0.38 |
| 1000:
$0.36 |
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