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FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA0951AT
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OCR Text |
... rapid cooling promotes a finer grain structure and a more crackresistant solder joint. Figure 4 indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable voidfree attac... |
Description |
3V Cellular CDMA PowerEdge Power Amplifier Module
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File Size |
547.82K /
11 Page |
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it Online |
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FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA0965
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OCR Text |
... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable... |
Description |
CDMA and CDMA2000-1X PowerEdge Power Amplifier Module
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File Size |
513.56K /
8 Page |
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it Online |
Download Datasheet
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Fairchild Semiconductor Corporation FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA0967
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OCR Text |
... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable... |
Description |
Cellular CDMA, CDMA2000-1X and WCDMA Power Edge Power Amplifier Module
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File Size |
131.73K /
8 Page |
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it Online |
Download Datasheet
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FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA1759
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OCR Text |
... rapid cooling promotes a finer grain structure and a more crackresistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable ... |
Description |
3.4V Korean PCS CDMA PA Module Korean-PCS PowerEdge Power Amplifier Module
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File Size |
536.06K /
8 Page |
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it Online |
Download Datasheet
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FAIRCHILD SEMICONDUCTOR CORP FAIRCHILD[Fairchild Semiconductor]
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Part No. |
RMPA2263
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OCR Text |
... rapid cooling promotes a finer grain structure and a more crack-resistant solder joint. The illustration below indicates the recommended soldering profile. Solder Joint Characteristics: Proper operation of this device depends on a reliable... |
Description |
WCDMA Power Amplifier Module 1920-1980 MHz
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File Size |
108.75K /
7 Page |
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it Online |
Download Datasheet
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VTI[VTI technologies]
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Part No. |
SCA3000
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OCR Text |
...s. Type 3 paste is recommended (grain size 25-45mm).
VTI Technologies Oy www.vti.fi
Subject to changes TN54
8/15 Rev.C
SCA3000 Assembly Instructions
5.3
Stencil
The solder paste is applied onto the PWB by using stencil pr... |
Description |
3-axis accelerometer
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File Size |
450.20K /
15 Page |
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it Online |
Download Datasheet
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Price and Availability
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