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MACOM[Tyco Electronics]
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| Part No. |
MA4SW410
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| OCR Text |
...M's Unique HMICTM (Heterolithic microwave Integrated Circuit) Process, US Patent 5,268,310. This process allows the incorporation of silicon...millimeter-wave frequencies.
Applications
These High Performance Switches are suitable for use i... |
| Description |
SP4T Monolithic PIN Diode Switch
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| File Size |
195.86K /
6 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MA4SW510
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| OCR Text |
...M/A-COM's HMIC TM (Heterolithic microwave Integrated Circuit) process, US Patent 5,268,310. This process allows the incorporation of silicon...millimeter-wave frequencies.
Applications
These high performance switches are suitable for the u... |
| Description |
SP5T PIN Diode Reflective Switch
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| File Size |
208.55K /
5 Page |
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it Online |
Download Datasheet |
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TriQuint Semiconductor, Inc.
TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TGF4230-SCC
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| OCR Text |
...er exhaust is a safety concern. microwave or radiant curing should not be used because of differential heating. Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes: * * * * * Thermosonic ball bondin... |
| Description |
DC - 12 GHz Discrete HFET
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| File Size |
217.49K /
9 Page |
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it Online |
Download Datasheet |
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TRIQUINT[TriQuint Semiconductor]
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| Part No. |
TGF4250-SCC
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| OCR Text |
...er exhaust is a safety concern. microwave or radiant curing should not be used because of differential heating. Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes: * * * * * Thermosonic ball bondin... |
| Description |
DC - 10.5 GHz Discrete HFET
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| File Size |
321.54K /
9 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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