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GSI
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Part No. |
GS881E32
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OCR Text |
...r a complete listing of current offerings
revision: 2/3/05 gs881e18/32/36ad supplemental datasheet information 256k x 32 gs881e32ad-200i pipeline/flow through 165 bga 200/6.5 i 256k x 32 gs881e32ad-166i pipeline/flow through 165 bga 166/7... |
Description |
(GS881E18 - GS881E36AD) Synchronous Burst SRAMs
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File Size |
680.98K /
37 Page |
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it Online |
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Xilinx
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Part No. |
XC2V2000
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OCR Text |
...k to 8m system gates. packaging offerings include ball grid array (bga) packages with 0.80 mm, 1.00 mm, and 1.27 mm pitches. in addition to tra- ditional wire-bond interconnects, flip-chip interconnect is used in some of the bga offerings. ... |
Description |
(XC2Vxxx) Virtex-II Platform FPGAs: Complete Data Sheet
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File Size |
1,725.73K /
311 Page |
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it Online |
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Kemet Corporation
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Part No. |
C0603C101J1GAC C0805C220J5GAC7800
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OCR Text |
...0 v, and 200 v ? capacitance offerings ranging from 0.5 pf up to 0.47 f ? available capacitance tolerances of 0.10 pf, 0.25 pf, 0.5 pf, 1%, 2%, 5%, 10%, and 20% ? no piezoelectric noise ? extremely low esr and esl ? high... |
Description |
C0G Dielectric, 10 ?200 VDC (Commercial Grade) Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) C0G Dielectric, 10 ?200 VDC (Commercial Grade)
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File Size |
784.79K /
19 Page |
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it Online |
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Price and Availability
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