|
|
![](images/bg04.gif) |
SGS Thomson Microelectronics
|
Part No. |
AN1120
|
OCR Text |
... commodity products, there is a rapidly growing market for application specific memories (asms). these are devices that are specifically opti- mized for particular applications. these include both custom devices, and standard products that ... |
Description |
EEPROM-BASED APPLICATION SPECIFIC MEMORIES
|
File Size |
51.76K /
7 Page |
View
it Online |
Download Datasheet
|
|
|
![](images/bg04.gif) |
SFI
|
Part No. |
SFI0805 SFI2220 SFI1206
|
OCR Text |
...s, the suppressor will draws a rapidly increasing current, and then the overvoltage is consid erably attenuated away from the protected circ uit, that is why the inherent protection of th e equipments should be supplemented by includin... |
Description |
SMD Transient Voltage Suppressors
|
File Size |
608.26K /
25 Page |
View
it Online |
Download Datasheet
|
|
|
![](images/bg04.gif) |
Advanced Analog Technology,lnc.
|
Part No. |
AAT4280AIJS-3-T1
|
OCR Text |
...tdown load discharge circuit to rapidly turn off a load cir- cuit when the switch is disabled. all aat4280a load switch versions operate with an input voltage ranging from 1.5v to 5.5v, making them ideal for both 3v and 5v systems. input ... |
Description |
Slew Rate Controlled Load Switch
|
File Size |
195.48K /
14 Page |
View
it Online |
Download Datasheet
|
|
|
![](images/bg04.gif) |
SGS Thomson Microelectronics
|
Part No. |
AN483
|
OCR Text |
...to the bonding pad and vibrated rapidly (in the ultrasonic range), causing the gold ball and silicon surface to weld together. the thicker aluminum wires are bonded using the simpler ultrasonic method, where the wire is sim- ply pressed ont... |
Description |
MIXED WIRE BONDING TECHNOLOGY FOR AUTOMOTIVE SMART POWER ICs
|
File Size |
307.34K /
4 Page |
View
it Online |
Download Datasheet
|
|
![](images/findchips_sm.gif)
Price and Availability
|