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Amphenol Communications Solutions |
Part No. |
95157-234LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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ROHM[Rohm] Rohm CO.,LTD.
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Part No. |
RPI-1133
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Description |
Photointerrupter double-layer mold type Sensors > Photointerrupters > Digital Phototransistor output
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File Size |
60.08K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68691-572
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
69157-272HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95157-208LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95157-212LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95157-240LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95157-230LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95157-216LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
52610-1572
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Description |
1.00mm (.039) Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 15 Circuits, Lead-free, High Barrier Packaging 1.00mm (.039") Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 15 Circuits, Lead-free, High Barrier Packaging
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File Size |
523.95K /
8 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
76745-157-26LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95157-212B06LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 12 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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