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solder-coat Datasheet PDF File

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				ABC Taiwan Electronics Corp
Part No.	CB3011220ML CB30112R5ML CB3011150ML CB30113R3ML CB3011100ML CB30111R0ML CB30111R8ML CB30114R7ML
OCR Text	...uded Temp. rise) dResistance to solder heat260.10 secs. AR-001A 200 150 70sec max. 100 50 0 50 100 150 Time ( seconds ) ...Coat Typ ____ ____ Polyamideimide Polyamide Modified Epoxy ____ ____ Polyamide ____ ____ ____ Nyl...
Description	SMD POWER INDUCTOR
File Size	119.27K / 6 Page	View it Online	Download Datasheet

				ABC Taiwan Electronics Corp
Part No.	SH3011330YL SH3011220YL SH30112R5YL SH3011150YL SH3011470YL SH3011680YL SH30114R7YL
OCR Text	...temp.-40----+105 dResistance to solder heat260.10 secs. Temperature ( ) GENERAL SPECIFICATION 200 150 70sec max. 100 50 0 ...Coat Typ ____ ____ Polyamideimide Polyamide Modified Epoxy ____ ____ Polyamide ____ ____ ____ Nyl...
Description	SHIELDED SMD POWER INDUCTOR
File Size	154.39K / 7 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	MZ5010G MZ5010GW
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	372.35K / 14 Page	View it Online	Download Datasheet

				ABC Taiwan Electronics Corp
Part No.	HP04011R0ML HP04011R2ML HP04011R5ML HP04012R2ML HP040147NML HP0401R10ML HP0401R22ML HP0401R47ML
OCR Text	... rise included ) cResistance to solder heat260. 10 secs. Temperature ( ) 250 200 150 70sec max. 100 50 0 50 100 150 Tim...Coat Typ BC Polyamideimide Polyurethane Polyesterimide Polyesterimide Polyesterimide Polyesterimide...
Description	SHIELDED SMD POWER INDUCTOR
File Size	105.93K / 6 Page	View it Online	Download Datasheet

				ABC Taiwan Electronics Corp
Part No.	HP04011R0M2 HP040147NM2 HP0401R10M2 HP0401R22M2 HP0401R47M2
OCR Text	... rise included ) cResistance to solder heat260. 10 secs. Temperature ( ) 250 50sec max. 200 150 70sec max. 100 50 0 50 ...Coat Typ OC ____ ____ ANSI Type MW81-C MW75C MW35C ___ ___ ___ MW74-C ___ MW79-C ___ ___ MW24...
Description	SHIELDED SMD POWER INDUCTOR
File Size	107.64K / 6 Page	View it Online	Download Datasheet

				ABC Taiwan Electronics Corp
Part No.	SR3015330KL SR3015220ML SR30152R2ML SR3015470KL SR3015100ML SR3015101KL SR3015150ML SR30154R7ML SR3015680KL
OCR Text	...temp.-40----+105 eResistance to solder heat260.10 secs. Temperature ( ) 250 50s ec max. 200 150 70sec max. 100 50 H 0 50 10...Coat Typ ____ ____ Polyamideimide Polyamide Modified Epoxy ____ ____ Polyamide ____ ____ ____ Nyl...
Description	SMD POWER INDUCTOR
File Size	134.59K / 7 Page	View it Online	Download Datasheet

				ABC Taiwan Electronics Corp
Part No.	SH3016330YL SH3016220YL SH3016470YL SH30163R6YL SH3016680YL SH3016101YL
OCR Text	...temp.-40----+105 dResistance to solder heat260.10 secs. Temperature ( ) 200 150 70s ec max. 100 50 0 50 100 150 Time ...Coat Typ BC Polyamideimide Polyurethane Polyesterimide Polyesterimide Polyesterimide Polyesterimide...
Description	SHIELDED SMD POWER INDUCTOR
File Size	147.01K / 7 Page	View it Online	Download Datasheet

				Motorola, Inc.
Part No.	MPXAZ4115A
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct fottprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Media Resistant,Integrated Silicon Pressure Sensor for Manifold Absolute Pressure,Altemeter or Barometer Applications On-Chip Signal Conditioned From old datasheet system MPXAZ4115A Media Resistant, Integrated Silicon Pressure Sensor for Manifold Absolute Pressure, Altimeter or Barometer Applications On-Chip Signal Conditioned, Temperature Compensated, and Calibrated
File Size	106.43K / 7 Page	View it Online	Download Datasheet

				Motorola
Part No.	MPXAZ6115A
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description	Media Resis and Hi Temp Silicon Pressure Sensor From old datasheet system
File Size	103.97K / 8 Page	View it Online	Download Datasheet

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