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  43045-0220 Datasheet PDF File

For 43045-0220 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    43045-1812

Molex Electronics Ltd.
Part No. 43045-1812
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits

File Size 166.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045HFLF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, Halogen free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    43045-0825

Molex Electronics Ltd.
Part No. 43045-0825
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits

File Size 182.53K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-3045LF
Description QSFP+ Cable Assembly, 28 AWG, 4.5ms, passive, non-halogen free
Tech specs    

Official Product Page

    43045-0824

Molex Electronics Ltd.
Part No. 43045-0824
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Vertical, with Press-fit Metal Retention Clip, 8 Circuits

File Size 182.72K  /  3 Page

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Amphenol Communications Solutions

Part No. 10134040-22000LF
Description HPCE CTB VT HEADER 4LP With latch
Tech specs    

Official Product Page

    MOLEX INC
Part No. 43045-0205
Description POWER CONNECTOR

File Size 67.23K  /  1 Page

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Amphenol Communications Solutions

Part No. 68002-201HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 1 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-0823

Molex Electronics Ltd.
Part No. 43045-0823
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row,

File Size 183.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 68002-203HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 3 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-0221

Molex Electronics Ltd.
Part No. 43045-0221
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Header, Surface Mount Compatible, Dual Row, Right Angle, with Press-fit Metal Retention Clip

File Size 183.81K  /  3 Page

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Amphenol Communications Solutions

Part No. 68002-207HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-2414

Molex Electronics Ltd.
Part No. 43045-2414
Description
File Size 166.54K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-802200800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    43045-2411

Molex Electronics Ltd.
Part No. 43045-2411
Description
File Size 180.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 84502-201
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    43045-2417

Molex Electronics Ltd.
Part No. 43045-2417
Description
File Size 174.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 94050-220CALF
Description Assembly, Top Mount, D/D(136Pins), R/A, 5V, 2mm s/o, Right Push Rod Eject, 8mm Card Travel, Narrow Body
Tech specs    

Official Product Page

    43045-2415

Molex Electronics Ltd.
Part No. 43045-2415
Description
File Size 174.05K  /  3 Page

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Amphenol Communications Solutions

Part No. 470-2205-100
Description Receptacle. mod,20Positions, 20.5mm, NEXLEV
Tech specs    

Official Product Page

For 43045-0220 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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