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Toshiba Electronic Devices & Storage Corporation |
Part No. |
XPN1300ANC
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Description |
N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10137513-001LF
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Description |
HPCE VT Receptacle 10LP Omitted 2LP
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
84513-001LF
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Description |
100 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54121-407051300LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10120513-002C-TRLF
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Description |
SAS/PCIe 3.0 (U.2) Connectors, Storage and Server Connector, 68 Position Vertical Recep SMT, 12Gb/s.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
50295-1300HLF
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Description |
High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 4 Row, 300 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
951300E70H
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Description |
XCede, High speed backplane connectors, 3-Pair, 8 Position, Open.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
84513-001
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Description |
100 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
951-300E-40H
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Description |
XCede, High speed backplane connectors, 3-Pair, 8 Position, Open.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54111-406051300LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Price and Availability
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