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Molex Electronics Ltd.
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| Part No. |
70247-1252 0702471252
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| Description |
2.54mm (.100") Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits
2.54mm (.100) Pitch C-Grid Header, Dual Row, Low Profile, Right Angle, Shrouded, 12 Circuits
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| File Size |
161.68K /
4 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
TLV702475DBVR
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| Description |
300mA Low-Iq Low-Dropout (LDO) Regulator for Portables 5-SOT-23 -40 to 125
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-0852 0702470852
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.68K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54242-105140950LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-0851 0702470851
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
161.67K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
75160-105-17LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,17 position, 2.54mm pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-3054 0702473054
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
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| File Size |
161.67K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
84809-201051LF
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| Description |
Metral® High Speed 2000 Series, Backplane Connectors, Header, Vertical Signal, 5 Row, Press-Fit, 30 Position, Select Load, Extended
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-3052 0702473052
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
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| File Size |
161.87K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
93690-105-16LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 16 Positions, 2.54 mm (0.100in) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70247-3051 0702473051
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
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| File Size |
161.87K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
65781-051LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, Vertical card connector, Double Row, 2.54mm (0.100in) pitch ,30 Positions
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702475054 70247-5054
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.127μm (5μ) Gold (Au) Plating, Tin(Sn) PC TailPlating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.127渭m (5渭") Gold (Au) Plating, Tin(Sn) PC TailPlating
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| File Size |
161.85K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10076801-105-12LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double row , 12 Positions, 2.54mm (0.100in) Pitch, Pin In Paste
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702475052 70247-5052
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.76渭m (30渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Platin
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| File Size |
161.87K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
95278-105-10LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0702475051 70247-5051
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Right Angle, Shrouded,50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100") Pitch C-Grid庐 Header, Dual Row, Low Profile, Right Angle, Shrouded,50 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plati
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| File Size |
161.87K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
G86105111YBEU
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| Description |
Board mount - Header Plug - Protect Header 2.0mm Pitch Vertical Dip,1x5Pin,Matte Tin,NY66,Tail=3.4mm.With Kink tail,Removed#5Pos
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Official Product Page
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Price and Availability
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