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  74649-2508 Datasheet PDF File

For 74649-2508 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    BU2508D

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. BU2508D
Description Silicon Diffused Power Transistor

File Size 47.98K  /  7 Page

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Amphenol Communications Solutions

Part No. 10137925-0841LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, 30u\\ Gold (Tin on Tails) plating, Black Color, 8 Positions, GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    BU2508D

Inchange Semiconductor Company Limited
Part No. BU2508D
Description isc Silicon NPN Power Transistor

File Size 78.07K  /  2 Page

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Amphenol Communications Solutions

Part No. 75160-325-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,8 position, 2.54mm pitch
Tech specs    

Official Product Page

    BU2508D

Savantic, Inc.
Part No. BU2508D
Description Silicon NPN Power Transistors

File Size 133.09K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137925-0812LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and DIP Hold Down Header, Tin plating, Black Color, 8 Positions, Non GW Compatible LCP, Tape and Reel. .
Tech specs    

Official Product Page

    Spaenaur
Part No. HN25085
Description x4 PROM x4胎膜早破

File Size 85.49K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-125-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 08 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    HN25084

Hitachi Semiconductor
Part No. HN25084
Description 2K x 8 TTL PROM Memory

File Size 81.76K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-103250800LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Toshiba
Part No. 2SC2508
Description Silicon NPN Epitaxial Planar Type

File Size 78.34K  /  2 Page

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Amphenol Communications Solutions

Part No. 54112-508121270LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TGA2508-SM

TriQuint Semiconductor
Part No. TGA2508-SM
Description Ku-Band VSAT Packaged Amplifier

File Size 419.99K  /  9 Page

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Amphenol Communications Solutions

Part No. 54122-825082750LF
Description BergStik, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking header, Through Hole, Double Row, 8 Positions.
Tech specs    

Official Product Page

    njr
Part No. NJM2508
Description
File Size 225.39K  /  10 Page

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Amphenol Communications Solutions

Part No. 54121-105250850LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TGA2508-SM-15

TriQuint Semiconductor
Part No. TGA2508-SM-15
Description Ku-Band VSAT Packaged Amplifier

File Size 356.61K  /  9 Page

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Amphenol Communications Solutions

Part No. 59202-G28-25-081LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 50 Positions.
Tech specs    

Official Product Page

    TGA2508-SCC-15

TriQuint Semiconductor
Part No. TGA2508-SCC-15
Description 12 19 GHz VSAT Amplifier

File Size 236.23K  /  11 Page

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Amphenol Communications Solutions

Part No. 75844-125-08LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 74649-2508 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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