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Fujitsu Limited
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Part No. |
MB8116160A-70
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Description |
CMOS 1 M ×16 BIT
Fast Page Mode DRAM(CMOS 1 M ×16 位快速页面存取模式动态RAM) CMOS 1 M ?16 BIT Fast Page Mode DRAM(CMOS 1 M ?16 浣?揩??〉?㈠???ā寮????AM)
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File Size |
329.44K /
25 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68458-116HLF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
55508-116LF
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Description |
Minitek® 2.00mm, Board to Board Connector, Low Profile, PCB Mounted Receptacle , Vertical , Surface Mount, Top Entry, Double row, 16 Positions, 2.00mm (0.079in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
30968-1167 0309681167
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Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #1, Gray
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File Size |
300.97K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
78548-116HLF
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Description |
78548-116HLF-B/S II HDR DR SELF-RET
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
30968-1168 0309681168
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Description |
2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64?/a> High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #2, Black 2.54mm (.100) Pitch, 0.64mm (.025) Width H-DAC 64 High Density AutomotiveCrimp Housing, Dual Row, 16 Circuits, Polarization Option #2, Black
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File Size |
300.97K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
69168-116
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Description |
69168-116-FRICTION LCH HDR DR VERT
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68418-116HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
131-8116-11H
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Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
RJE711881161
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Description |
Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
RJE721881163
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Description |
Modular Jack - High Performance, Input Output Connectors 8P8C, Shield, With LEDs.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10139781-163706LF
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Description |
Bergstak plus receptacle 160pos
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10143578-116KLF
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Description |
Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 16 Position,staggered,side Latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
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Tech specs |
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Official Product Page
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Price and Availability
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