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  extended temp xfmr module Datasheet PDF File

For extended temp xfmr module Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    V23826-H18-C366 SCDUPLEXIR1X93.3V-40

INFINEON[Infineon Technologies AG]
Part No. V23826-H18-C366 SCDUPLEXIR1X93.3V-40
Description DC/DC (3.3V) Single Mode 622 MBd ATM/SDH/SONET 1x9 Transceiver extended temperature Range 直流/直流电压3.3V)单22 MBd的ATM SDH / SONETx9收发器扩展温度范
Single Mode 622 MBd ATM/SDH/SONET 1x9 Transceiver extended temperature Range (40C to 85C)
Transceivers by Form-factor MSA - ATM/SONET/SDH, 1300 nm, 622 Mbit/s, 15 km, 1x9, DC/DC coupling, Ext. temp. Range, SC, 3.3 V

File Size 357.70K  /  14 Page

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    F2M03GX-S01

List of Unclassifed Manufacturers
Part No. F2M03GX-S01
Description extended range Bluetooth module - F2M03GX /GXA

File Size 837.57K  /  47 Page

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    PUMA2F16006M-90 PUMA2F16006-90 PUMA2F16006M-120E PUMA77F16006AI-90E PUMA77F16006AI-70 PUMA2F16006I-90 PUMA2F16006-120

Infineon Technologies AG
Amphenol Tuchel
Part No. PUMA2F16006M-90 PUMA2F16006-90 PUMA2F16006M-120E PUMA77F16006AI-90E PUMA77F16006AI-70 PUMA2F16006I-90 PUMA2F16006-120
Description 32-Tap, Volatile DPP with I2C/DEC, Up/Down Interface, TSSOP
BGA, ROHS-A, IND temp, T&R(ARM)
BGA,GREEN,IND temp,T&R(ARM)
x32 Flash EEPROM module X32号,闪存EEPROM模块
EEPROM EEPROM

File Size 366.34K  /  25 Page

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    M20-9612645 M20-9601846 M20-9610445 M20-9972245 M20-9612045 M20-9611246 M20-9970346 M20-9972346 M20-9600545 M20-9613145

Harwin PLC
Part No. M20-9612645 M20-9601846 M20-9610445 M20-9972245 M20-9612045 M20-9611246 M20-9970346 M20-9972346 M20-9600545 M20-9613145 M20-9973746 M20-9600746
Description 2.54mm Pitch SIL extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 26-way 26 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL extended Pin Header, 16.8mm board-stacking height, tin, 18 18-way 36 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch SIL extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 4-way 4 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Vertical PC Tail Pin Header, 8.5mm mating pin height, gold (hi-temp mould), 22 22-way 44 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch SIL extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 20-way 20 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch SIL extended Pin Header, 16.8mm board-stacking height, tin, 12-way 12 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Vertical PC Tail Pin Header, 8.5mm mating pin height, tin, 3 3-way 6 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Vertical PC Tail Pin Header, 8.5mm mating pin height, tin, 23 23-way 46 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 5 5-way 10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch SIL extended Pin Header, 16.8mm board-stacking height, gold (hi-temp mould), 31-way 31 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL Vertical PC Tail Pin Header, 8.5mm mating pin height, tin, 37 37-way 74 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
2.54mm Pitch DIL extended Pin Header, 16.8mm board-stacking height, tin, 7 7-way 14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 780.82K  /  1 Page

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    MICROSEMI[Microsemi Corporation]
Part No. LXM1614-14-11 LXM1614
Description DUAL DIMMING/ extended tempEERATURE CCFL INVERTER module
DUAL DIMMING, extended tempEERATURE CCFL INVERTER module

File Size 320.85K  /  9 Page

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    MICROSEMI[Microsemi Corporation]
Part No. LXMG1614E-14-11
Description DUAL DIMMING, extended tempERATURE CCFL INVERTER module

File Size 338.64K  /  9 Page

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    MICROSEMI[Microsemi Corporation]
Part No. LXM1614E-14-11
Description DUAL DIMMING, extended tempERATURE CCFL INVERTER module

File Size 296.24K  /  9 Page

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    PUMA68F64006AM-15 PUMA68F64006AM-15E PUMA68F64006AI-12 PUMA68F64006A-90 PUMA68F64006-90

ON Semiconductor
Part No. PUMA68F64006AM-15 PUMA68F64006AM-15E PUMA68F64006AI-12 PUMA68F64006A-90 PUMA68F64006-90
Description 4NS, 144 TQFP, COM temp(FPGA)
2NS, 240 PQFP, COM temp(FPGA)
15K GATE, 4NS, 84 PLCC, IND temp(FPGA) EEPROM
4NS, 100 VQFP, COM temp(FPGA) EEPROM
9K GATE, 2NS, 132 BQFP, IND temp(FPGA) EEPROM

File Size 69.20K  /  3 Page

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    VICOR[Vicor Corporation]
Vicor, Corp.
Part No. MICRORAM URAM2H21 URAM2C21 URAM3TS3 URAM2C11 URAM2C12 URAM2C13 URAM2C22 URAM2C23 URAM2CN1 URAM2CN2 URAM2CN3 URAM2CS1 URAM2CS2 URAM2CS3 URAM2H11 URAM2H12 URAM2H13 URAM2H22 URAM2H23 URAM2HN1 URAM2HN2 URAM2HN3 URAM2HS1 URAM2HS2 URAM2HS3 URAM2M11 URAM2M12 URAM2M13 URAM2M21 URAM2M22 URAM2M23 URAM2MN1 URAM2MN2 URAM2MN3 URAM2MS1 URAM2MS2 URAM2MS3 URAM2T11 URAM2T12 URAM2T13 URAM2T21 URAM2T22 URAM2T23 URAM2TN1 URAM2TN2 URAM2TN3 URAM2TS1 URAM2TS2 URAM2TS3 URAM3C11 URAM3C12 URAM3C13 URAM3C21 URAM3C22 URAM3C23 URAM3CN1 URAM3CN2 URAM3CN3 URAM3CS1 URAM3CS2 URAM3CS3 URAM3H11 URAM3H12 URAM3H13 URAM3H21 URAM3H22 URAM3H23 URAM3HN1 URAM3HN2 URAM3HN3 URAM3HS1 URAM3HS2 URAM3HS3 URAM3M11 URAM3M12 URAM3M13 URAM3M21 URAM3M22 URAM3M23 URAM3MN1 URAM3MN2 URAM3MN3 URAM3MS1 URAM3MS2 URAM3MS3 URAM3T11 URAM3T12 URAM3T13 URAM3T21 URAM3T22 URAM3T23 URAM3TN1 URAM3TN2 URAM3TN3 URAM3TS1 URAM3TS2
Description    Output Ripple Attenuation module
temperature Range:-40 C to 85 C; Capacitance:4700uF RoHS Compliant: Yes
O-RING, METALOK BANTAM; temp, op. max:125(degree C); temp, op. min:-55(degree C); Series:METALOK BANTAM
Output Ripple Attenuation module 输出纹波衰减模块
Crimp Socket Contact; Wire Size (AWG):28; Contact Size:16; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes

File Size 1,180.91K  /  8 Page

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    ADVANCED MICRO DEVICES INC
Part No. AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT-80DPI2 AM29LV800BT-80DWC2 AM29LV800BT-80DWI2 AM29LV800BT-80DGC2 AM29LV800BT-80DTI2 AM29LV800BT-80DPC2 AM29LV800BB-80DGI2 AM29LV800BB-80DPI2 AM29LV800BB-80DTI2 AM29LV800BB-80DWC2 AM29LV800BB-80DWI2 AM29LV800BB-80DPC2 AM29LV800BB-80DGC2 AM29LV800BB-80DTC2 AM29LV800BB-120DTC2 AM29LV800BT-90DPI2 AM29LV800BT-90DTI2 AM29LV800BT-90DWI2 AM29LV800BT-120DTI2 AM29LV800BB-120DTI2 AM29LV800BT-120DGI2 AM29LV800BT-120DTC2 AM29LV800BB-90DTI2 AM29LV800BB-90DGC2 AM29LV800BB-120DGC2 AM29LV800BT-120DPC2 AM29LV800BT-90DPC2 AM29LV800BT-120DWI2 AM29LV800BB-120DPC2 AM29LV800BB-90DPC2 AM29LV800BB-90DWI2
Description 25NS,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, PLCC, COM temp(EPLD)
20NS, SOIC, IND temp(EPLD)
25NS, SOIC, COM temp(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM temp(FPGA)
10MHZ, 20 PLCC, IND temp(FPGA)
10MHZ, 32 TQFP, COM temp(FPGA)
10MHZ, 44 PLCC, COM temp(FPGA)
30MHZ, 3.3V, 20 PLCC, COM temp(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND temp,1.8V(SERIAL EE)
65K CONFIG MEM, 20 PLCC, IND temp(FPGA)
10MHZ, 20 SOIC, IND temp(FPGA)
128K CONFIG MEM, 20 PLCC, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM temp(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM temp(FPGA)
10MHZ, 20 PLCC, COM temp(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44

File Size 127.66K  /  11 Page

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