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AX88190P DA0717 AT1452AP CX1VCSM1 74LVC 6TPE330 0235G 1N827
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  link-layer Datasheet PDF File

For link-layer Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    ROHM[Rohm]
Rohm CO.,LTD.
Part No. RPI-121
Description Sensors > Photointerrupters > Linear Phototransistor output
Photointerrupter, double-layer mold type
Photointerrupter/ double-layer mold type

File Size 75.81K  /  3 Page

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    Vicor, Corp.
STMicroelectronics N.V.
意法半导
STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
SGS Thomson Microelectronics
Part No. ST20-PPIUK ST20-PPI ST20-PPI110 ST20-PPI220 ST20-PPI-UK ST20-PPI-110 ST20-PPI-220
Description PC PARALLEL PORT TO OS-LINK INTERFACE 并行端口的PC操作系统- Link接口
PC PARALLEL PORT TO OS-LINK INTERFACE 并行端口PC操作系统- Link接口
Cyclone II FPGA 15K FBGA-256
CYCLONE III FPGA 119K 780FBGA
Cyclone II FPGA 15K FBGA-484
PC PARALLEL PORT TO OS-LINK INTERFACE

File Size 57.35K  /  6 Page

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    Broadcom
BOARDCOM
Part No. BCM5697
Description 12-Port Layer 2 Gigabit Ethernet Switch with HiGig ™ stacking
12-PORT GIGABIT ETHERNET STACKABLE LAYER 2 SWITCH

File Size 105.35K  /  2 Page

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    TL7232 TL7232MD S5L9275

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. TL7232 TL7232MD S5L9275
Description FULL LAYER-III ISO/IEC 11172-3 AUDIO CODEC
Full Layer-III ISO/IEC 11172-3 Audio Decoder Data Sheet
FULL LAYER- ISO/IEC 11172-3 AUDIO DECODER
FULL LAYER-ゲ ISO/IEC 11172-3 AUDIO DECODER

File Size 414.03K  /  37 Page

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    RPI-124

Rohm
Part No. RPI-124
Description Sensors > Photointerrupters > Linear Phototransistor output
PHOTO INTERRUPTER, DOUBLE-LAYER MOLD TYPE
Photo interrupter/ double-layer mold type

File Size 73.34K  /  3 Page

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    Lineage Power, Corp.
Part No. HW3000M HW2000
Description Home Phoneline Networking Physical Layer(主电话线网络物理 家庭电话线网络物理层(主电话线网络物理层
Home Phoneline Networking Physical Layer(涓荤?璇?嚎缃???╃?灞?

File Size 93.12K  /  6 Page

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    PA-5R0V474 PB-5R0H474-R PA-5R0V224 PA-5R0V224-R

Cooper Bussmann, Inc.
HIROSE ELECTRIC Co., Ltd.
Part No. PA-5R0V474 PB-5R0H474-R PA-5R0V224 PA-5R0V224-R
Description CAPACITOR .47F 5V RAD AEROGEL CAPACITOR, ELECTRIC DOUBLE LAYER, 5 V, 470000 uF, THROUGH HOLE MOUNT
CAPACITOR, ELECTRIC DOUBLE LAYER, 5 V, 470000 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, ELECTRIC DOUBLE LAYER, 5 V, 220000 uF, THROUGH HOLE MOUNT RADIAL LEADED

File Size 64.41K  /  2 Page

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    Bourns Inc.
Bourns, Inc.
Part No. CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210-8N2J CI201210-2N2D CI201210-2N7D CI201210-R33J CI201210-R39J CI201210-47NJ CI201210-R47J CI201210-33NJ CI201210-1N8D CI201210-1N0D CI201210-R27J CI201210-R12J CI201210-68NJ CI201210-1N5D CI201210-R18J CI201210-18NJ CI201210-10NJ
Description Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 433.40K  /  2 Page

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    Bourns Inc.
Bourns, Inc.
Part No. CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808-2N2D CI160808-2N7D CI160808-6N8J CI160808-4N7D CI160808-8N2J CI160808-R22J CI160808-R27J CI160808-1N8D CI160808-56NJ CI160808-68NJ CI160808-18NJ CI160808-R15J CI160808-27NJ CI160808-R18J
Description Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

File Size 243.82K  /  2 Page

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    Micronas Semiconductor Holding AG
Part No. MAS3519F MAS3529F MAS3539F MAS3549F MAS3559F MAS35X9F MAS3509F
Description MAS 35x9F MPEG Layer 2/3, AAC Audio Decoder, G.729 Annex A Codec 新加坡金融管理局35x9F的MPEG 2 / 3层,AAC音频解码器,G.729的附A编解码器
(MAS35x9F) MPEG Layer 2/3 AAC Audio Decoder
MAS 35x9F MPEG Layer 2/3, AAC Audio Decoder, G.729 Annex A Codec 新加坡金融管理局35x9F的MPEG 2 / 3层,AAC音频解码器,G.729的附件A编解码器

File Size 1,175.23K  /  92 Page

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