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  pads Datasheet PDF File

For pads Found Datasheets File :: 17838    Search Time::4.344ms    
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    M/A-COM Technology Solu...
Part No. MADP-000552-12810T
OCR Text ...ace mount technology. mounting pads are conveniently located on the bottom surface of these devices and are removed from the active junction locations. these devices are well suited for solder attachment onto hard and soft substrates. ...
Description SURMOUNT PIN Diode

File Size 803.56K  /  6 Page

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    CC2015FC CC2015WB CC2520FC CC2520WB CC1512FC

List of Unclassifed Manufacturers
ETC
Part No. CC2015FC CC2015WB CC2520FC CC2520WB CC1512FC
OCR Text ..., includes bondable termination pads to receive aluminum wire bonds. * Thermal resistance is provided to optimize high power designs when utilizing higher thermal conductivity circuit board substrates such as IMS or Alumina. * Resistance ra...
Description Low Resistance Precision Chip Resistors

File Size 94.59K  /  2 Page

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    MADS-002502-1246HP MADS-002502-1246LP MADS-002502-1246MP MA4E2502H-1246 MA4E2502H-1246T MA4E2502H-1246W MA4E2502L-1246 M

M/A-COM Technology Solutions, Inc.
Part No. MADS-002502-1246HP MADS-002502-1246LP MADS-002502-1246MP MA4E2502H-1246 MA4E2502H-1246T MA4E2502H-1246W MA4E2502L-1246 MA4E2502L-1246T MA4E2502L-1246W MA4E2502 MA4E2502H MA4E2502M-1246W MA4E2502M-1246T
OCR Text ...tacts to the metalized mounting pads on the bottom surface of the chip. These devices are reliable, repeatable, and a lower cost performance solution to conventional devices. They have lower susceptibility to electrostatic discharge than co...
Description SILICON, HIGH BARRIER SCHOTTKY, KU BAND, MIXER DIODE
SURMOUNTTM Low, Medium, and High Barrier Silicon Schottky Diodes

File Size 106.93K  /  5 Page

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    BPW049-0830-07CB95 CPW49-0830-07CB95 BCW49-0830-07CB95 BPW49-0830-07CB95

Actel Corporation
Part No. BPW049-0830-07CB95 CPW49-0830-07CB95 BCW49-0830-07CB95 BPW49-0830-07CB95
OCR Text ...t to the same PCB footprint and pads as required by the BGA, or any other IC package the socket was designed for (except if locating pegs are used; see `Locating Pegs' section of this document). When compared to mounting a BGA, an extra vol...
Description BGA49, IC SOCKET
SE-CSG49, E-Tec lead free prototype socket drawing for CSG49 and CSG49 packages

File Size 1,089.94K  /  8 Page

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    ST70137 ST70137TQFP

STMICROELECTRONICS[STMicroelectronics]
ST Microelectronics
Part No. ST70137 ST70137TQFP
OCR Text ...TTL LOGIC LEVELS (DEPENDING ON pads) COMPATIBLE s POWER MANAGEMENT s LOW POWER CONSUMPTION : 0.4W s TQFP 144 ST70137 SOFTWARE FEATURES s RFC 2364 PPP OVER ATM s UNI 3.0, 3.1, 4.0 SIGNALING s UBR, CBR s AAL0, AAL5 s NDIS5.0 PCI DRIVE...
Description UNICORNTM PCI & USB CONTROLLERLESS ADSL DMT TRANSCEIVER

File Size 139.22K  /  22 Page

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    MADS-002545-1307 MADS-002545-1307H MADS-002545-1307HT MADS-002545-1307L MADS-002545-1307LG MADS-002545-1307LT MADS-00254

M/A-COM Technology Solutions, Inc.
Part No. MADS-002545-1307 MADS-002545-1307H MADS-002545-1307HT MADS-002545-1307L MADS-002545-1307LG MADS-002545-1307LT MADS-002545-1307M MADS-002545-1307HG
OCR Text ...tacts to the metalized mounting pads on the bottom surface of the chip. These devices are reliable, repeatable, and a lower cost performance solution to conventional devices. They have lower susceptibility to electrostatic discharge than co...
Description SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip

File Size 56.46K  /  3 Page

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    MAXIM - Dallas Semiconductor
Part No. MAX15046BEVKIT
OCR Text ...15046b ev kit includes pcb pads to enable the circuit and to monitor the power-good output. features s 5v to 40v (24v typ) input range s optional 4.5v to 5.5v input range s 3.3v at 10a outpu...
Description Evaluation Kit for the MAX15046B

File Size 203.63K  /  7 Page

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    STP2223BGA

ETC
Part No. STP2223BGA
OCR Text ...ogy. The U2P die has 352 signal pads (including specialty power/grounds) and 104 VSS/VDD pads for a total pad count of 456. The U2P package is a 456 pin PBGA, with 352 signal pins and 104 VSS/VDD pins. Its die consists of 170k gates and 29k...
Description UPA to PCI Interface

File Size 152.14K  /  34 Page

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    DS46 LXHL-LB3C LXHL-LE3C LXHL-LM3C LXHL-LR3C LXHL-LW3C LXHL-FB3C LXHL-FM3C LXHL-FW3C

Lumileds Lighting Company
Part No. DS46 LXHL-LB3C LXHL-LE3C LXHL-LM3C LXHL-LR3C LXHL-LW3C LXHL-FB3C LXHL-FM3C LXHL-FW3C
OCR Text ...w. 2.Electrical interconnection pads labeled on the aluminum core PCB with "+" and " " to denote positive and negative, respectively. All positive pads are interconnected, as are all negative pads, allowing for flexibility in array intercon...
Description power light source LUXEON? III Star
power light source LUXEON垄莽 III Star
power light source LUXEON㈢ III Star

File Size 354.26K  /  15 Page

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    DN510

List of Unclassifed Manufacturers
ETC
Part No. DN510
OCR Text ... The DN510 electrical output pads are Pd-Pt-Ag and can be soldered. The solder used, such as SN-62, should contain silver to prevent leaching of the pads from the substrate. 0.010" 0.060" Temperature Variation with Load Control Tempe...
Description SUBMINIATURE PROPORTIONALLY CONTROLLED HEATER

File Size 338.95K  /  2 Page

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