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  168-pin Datasheet PDF File

For 168-pin Found Datasheets File :: 7832    Search Time::0.985ms    
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    Kingston Technology
Part No. KVR133X64C2/512
OCR Text ...33 sdram in tsop packages. this 168-pin dimm uses gold contact fingers and requires +3.3v. the electrical and mechanical specifications are as follows: features: clk cycle time (t cc ) min. = 7.5ns (cas latency = 2) / max. = 1000ns row cycl...
Description 512MB 64M x 64-Bit PC133 CL2 168-pin DIMM Module

File Size 77.87K  /  1 Page

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    Kingston Technology
Part No. KVR133X64C2/256
OCR Text ...33 sdram in tsop packages. this 168-pin dimm uses gold contact fingers and requires +3.3v. the electrical and mechanical specifications are as follows: features: clk cycle time (t cc ) min. = 7.5ns (cas latency = 2) / max. = 1000ns row cycl...
Description 256MB 32M x 64-Bit PC133 CL2 168-pin DIMM Module

File Size 84.66K  /  1 Page

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    IBM Microeletronics
Part No. IBM13M64734BCA
OCR Text ...cument. page 1 of 20 features ? 168-pin registered 8-byte dual in-line memory module ? 64mx72 synchronous dram dimm ? performance: ? intended for 66/100mhz and pc100 applica- tions ? inputs and outputs are lvttl (3.3v) compatible ? single 3...
Description 64M x 72 1 Bank Registered/Buffered SDRAM Module(64M x 72 1组寄缓冲同步动态RAM模块)

File Size 160.83K  /  20 Page

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    IBM Microeletronics
Part No. IBM13M8734HCB
OCR Text ...cument. page 1 of 19 features ? 168-pin registered 8-byte dual in-line memory module ? 8mx72 synchronous dram dimm ? performance (registered mode): ? intended for 66/100mhz and pc100 applications ? all inputs and outputs are lvttl (3.3v) co...
Description 8M x 72 1 Bank Registered SDRAM Module with PLL(8M x 72 1组带锁相环的寄存同步动态RAM模块)

File Size 149.11K  /  19 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KMM364C213CK
OCR Text ...8pin tssop package mounted on a 168-pin glass-epoxy substrate. a 0.1 or 0.22uf decoupling capacitor is mounted on the printed cir- cuit board for each dram. the kmm364c213c is a dual in- line memory module and is intended for mounting into ...
Description 2M x 64 DRAM DIMM(2M x 64 动RAM模块)

File Size 366.80K  /  19 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KMM366F1600BK2 KMM366F1680BK2
OCR Text ... 8-pin sop package mounted on a 168-pin glass- epoxy substrate. a 0.1 or 0.22uf decoupling capacitor is mounted on the printed circuit board for each dram. the kmm366f160(8)0bk2 is a dual in-line memory module and is intended for mounting i...
Description 16M x 64 DRAM DIMM(16M x 64 动RAM模块)
16M x 64 DRAM DIMM(16M x 64 ?ㄦ?RAM妯″?)

File Size 425.18K  /  20 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. KMM366F1600BK3 KMM366F1680BK3
OCR Text ... 8-pin sop package mounted on a 168-pin glass- epoxy substrate. a 0.1 or 0.22uf decoupling capacitor is mounted on the printed circuit board for each dram. the kmm366f160(8)0bk3 is a dual in-line memory module and is intended for mounting i...
Description 16M x 64 DRAM DIMM(16M x 64 动RAM模块)
16M x 64 DRAM DIMM(16M x 64 ?ㄦ?RAM妯″?)

File Size 444.05K  /  21 Page

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    SpecTek
Part No. P8M6416YLE P8M648YL P8M648YLE
OCR Text ... compatible jedec C standard 168-pin , dual in-line memory module (dimm) tsop components. single 3.3v +.3v power supply. nonbuffered fully synchronous; all signals measured on positive edge of system clock. internal pipelined...
Description (P8M648YLx / P8M6416YLEx) 8M/16M x 64 DIMM SDRAM Module

File Size 65.04K  /  5 Page

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