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Molex Electronics Ltd.
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Part No. |
26-19-2041 319004A
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Description |
KK? 396 Wire-to-Board Header, Vertical, Round Pin, with Polarizing Wall, 4 Circuits, Tin (Sn) Plating KK? 396 Wire-to-Board Header, Vertical, Round Pin, with Polarizing Wall, 4 Circuits, Tin (Sn) Plating
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File Size |
64.30K /
2 Page |
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it Online |
Download Datasheet
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Rochester Electronics LLC |
Part No. |
9004FM/B
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Description |
9004 - NAND Gate, 9004 Series
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10115859-004LF
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Description |
HPCE R/A REC 36P24S
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
91269-004LF
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Description |
Minitek® 2.00mm, Board to Board, Shrouded Header - Through Hole - Single row - 4 Positions - 2mm (0.079in) - Right Angle.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-414HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-434HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-454HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Molex, Inc.
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Part No. |
74752-9004 74752-9001 74752-4501 74752-4101 74752-3101 74752-1101
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Description |
SFP Copper Patch Cbl 10G-10M(Pass w/o eq INTERCONNECTION DEVICE SFP Copper Patch Cbl(Pssv w/o EQ)30 AWG INTERCONNECTION DEVICE SFP Copper Patch Cable 10G - 5 M 24AWG INTERCONNECTION DEVICE SFP Copper Patch Cable 10G - 1 M 24AWG INTERCONNECTION DEVICE SFP Copper Patch Cable 10G - 1M 26AWG INTERCONNECTION DEVICE SFP Copper Patch Cable 10G - 1 M INTERCONNECTION DEVICE
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File Size |
410.89K /
4 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
87900-418HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-438HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-458HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
71249-0043LF
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Description |
Card Bus Header, Top Mount, S/D(68Pins), VTB, Type 123, 3.3V, 4.3mm s/o
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Tech specs |
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Official Product Page
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Price and Availability
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