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  87759-2450 Datasheet PDF File

For 87759-2450 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-3865

Molex Electronics Ltd.
Part No. 87759-3865
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 10132450-0611GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-1876

Molex Electronics Ltd.
Part No. 87759-1876
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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Amphenol Communications Solutions

Part No. 54112-812262450LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 61083-124506LF
Description BERGSTAK 0.8MM
Tech specs    

Official Product Page

    87759-1614

Molex Electronics Ltd.
Part No. 87759-1614
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.27K  /  8 Page

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Amphenol Communications Solutions

Part No. 66245-020LF
Description Quickie® IDC Cable-to-Board Connector System, Backplane - Double row - 20 Positions - 2.54 mm (0.100in) .
Tech specs    

Official Product Page

    87759-3465

Molex Electronics Ltd.
Part No. 87759-3465
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 68482-450HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1815

Molex Electronics Ltd.
Part No. 87759-1815
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 10132450-2421GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 24 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-4466

Molex Electronics Ltd.
Part No. 87759-4466
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 298.85K  /  6 Page

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Amphenol Communications Solutions

Part No. 10132450-1021GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 10 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-3015

Molex Electronics Ltd.
Part No. 87759-3015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 10132450-0621GLF
Description Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
Tech specs    

Official Product Page

    87759-7626

Molex Electronics Ltd.
Part No. 87759-7626
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.91K  /  6 Page

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Amphenol Communications Solutions

Part No. 68692-450H
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4275

Molex Electronics Ltd.
Part No. 87759-4275
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 77312-450LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single row , Duplex, Polarized, 3 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 87759-2450 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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