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  87759-4051 Datasheet PDF File

For 87759-4051 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-1474

Molex Electronics Ltd.
Part No. 87759-1474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 421.28K  /  8 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 74HC4051FT
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-1415

Molex Electronics Ltd.
Part No. 87759-1415
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.56K  /  6 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 74VHC4051AFT
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, TSSOP16B, -40 to 125 degC, AEC-Q100
Tech specs    

Official Product Page

    87759-4064

Molex Electronics Ltd.
Part No. 87759-4064
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.98K  /  8 Page

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Toshiba Electronic Devices & Storage Corporation

Part No. 74HC4051D
Description CMOS Logic IC, SP8T(1:8)/Analog Multiplexer, SOIC16, -40 to 125 degC
Tech specs    

Official Product Page

    87759-1014

Molex Electronics Ltd.
Part No. 87759-1014
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.16K  /  8 Page

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Rochester Electronics LLC

Part No. HI4-0516-8/B
Description HI4-0516 - Differential Multiplier
Tech specs    

Official Product Page

    87759-1015

Molex Electronics Ltd.
Part No. 87759-1015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 10136654-0511LF
Description Minitek® Pwr 3.0, Single Row, Right Angle Through Hole Header, Tin plating, 5 Positions, Black Color, GW Compatible LCP, Tray packing.
Tech specs    

Official Product Page

    87759-1875

Molex Electronics Ltd.
Part No. 87759-1875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. G832MB010405122HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 7.7 mm, 40 Positions, Dual Row, BTB Vertical Receptacle SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    87759-1450

Molex Electronics Ltd.
Part No. 87759-1450
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 14 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 68405-130HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87759-1814

Molex Electronics Ltd.
Part No. 87759-1814
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.10K  /  8 Page

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Amphenol Communications Solutions

Part No. 68405-172
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87759-1250

Molex Electronics Ltd.
Part No. 87759-1250
Description
File Size 174.22K  /  4 Page

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Amphenol Communications Solutions

Part No. 68405-140HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    87759-4665

Molex Electronics Ltd.
Part No. 87759-4665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 68405-154HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 54 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For 87759-4051 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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