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  						Molex Electronics Ltd.  
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						| Part No. | 
						0901303244 90130-3244 
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						| Description | 
						2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 44 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 44 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
 
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						| File Size | 
						168.54K  / 
						4 Page | 
						
						 
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						it Online  | 
						
						  
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												Amphenol Communications Solutions  | 
					 
					
						| Part No. | 
						68690-130HLF 
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						| Description | 
						BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
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						Official Product Page
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  						Molex Electronics Ltd.  
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						| Part No. | 
						0901303240 90130-3240 
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						| Description | 
						2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 40 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
 
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						| File Size | 
						168.45K  / 
						4 Page | 
						
						 
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						it Online  | 
						
						  
						Download Datasheet
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												Amphenol Communications Solutions  | 
					 
					
						| Part No. | 
						78290-130HLF 
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						| Description | 
						BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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						Official Product Page
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  						Molex Electronics Ltd.  
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						| Part No. | 
						0901303208 90130-3208 
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						| Description | 
						2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 8 Circuits, Black 0.38μm (15μ) Gold (Au) Selective Plating
 
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						| File Size | 
						168.45K  / 
						4 Page | 
						
						 
						  View 
						it Online  | 
						
						  
						Download Datasheet
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												Amphenol Communications Solutions  | 
					 
					
						| Part No. | 
						L17H2990130 
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						| Description | 
						Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26  (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
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  						Molex Electronics Ltd.  
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						| Part No. | 
						90130-1218 0901301218 
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						| Description | 
						2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
 
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						| File Size | 
						586.12K  / 
						7 Page | 
						
						 
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						it Online  | 
						
						  
						Download Datasheet
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												Amphenol Communications Solutions  | 
					 
					
						| Part No. | 
						92090-130LF 
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						| Description | 
						Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
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						Official Product Page
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  						Molex Electronics Ltd.  
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						| Part No. | 
						90130-1208 0901301208 
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						| Description | 
						2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
 
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						| File Size | 
						586.12K  / 
						7 Page | 
						
						 
						  View 
						it Online  | 
						
						  
						Download Datasheet
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												Amphenol Communications Solutions  | 
					 
					
						| Part No. | 
						10065490-130TRLF 
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						| Description | 
						Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
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						Official Product Page
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  						Molex Electronics Ltd.  
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						| Part No. | 
						90130-1206 0901301206 
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						| Description | 
						2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
 
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						| File Size | 
						586.12K  / 
						7 Page | 
						
						 
						  View 
						it Online  | 
						
						  
						Download Datasheet
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												Amphenol Communications Solutions  | 
					 
					
						| Part No. | 
						69190-130HLF 
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						| Description | 
						BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30  Positions, 2.54 mm (0.100in) Pitch.
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						Official Product Page
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