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Murata Manufacturing Co Ltd |
| Part No. |
MGN1S1212MC-R7
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| Description |
DC-DC 1W SM 12-12V GAN
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361102 90136-1102
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
 View
it Online |
Download Datasheet
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Rochester Electronics LLC |
| Part No. |
AM27C512-120DC
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| Description |
AM27C512 - 512K (64K x 8) CMOS EPROM
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
AM27C512-120DE
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| Description |
AM27C512 - 512K (64K x 8) CMOS EPROM
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| Tech specs |
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Official Product Page
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Rochester Electronics LLC |
| Part No. |
AM27C512-120PI-G
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| Description |
AM27C512 - 512Kb (64K x 8-Bit) CMOS OTP EPROM
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901362202 90136-2202
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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| File Size |
254.60K /
5 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361318 90136-1318
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| Description |
2.54mm (.100) Pitch C-Grid III?Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
159.40K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
G87MP121212P1HR
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| Description |
Mini power plus, Vertical, Dual row, 4.2mm pitch, 12 positions , 100u\\ Tin, 3.50mm tail length, 2 posts, LCP, Natural , TRAY
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77317-812-12LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 12 Positions ,2.54mm (0.100in) Pitch,
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021212-00040T4LF
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| Description |
Minitek127®, Board/Wire to Board connector, Shrouded Right Angled Header, Through Hole, Double Row, 40 Positions, 1.27 mm (.050in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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