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Pasternack Enterprises, Inc.
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| Part No. |
LMR-200
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| OCR Text |
... a pvc jacket and un-bonded aluminum tape to facilitate end stripping with automated equipment. ? low loss ...pair tc-200-bm tc-200-muhf ez-200-nmh-d tc-200-nm tc-200-nm-rp tc-200-sm tc-200-sm-rp ez-200-tm tc-2... |
| Description |
Flexible Low Loss Communications Coax
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| File Size |
216.71K /
4 Page |
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it Online |
Download Datasheet
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Hittite Microwave Corpo...
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| Part No. |
HMC-ABH241
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| OCR Text |
...bonds should be thermosonically bonded with a force of 40-60 grams. dc bonds of 0.001 (0.025 mm) diameter, thermosonically bonded, are recommended. ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. ... |
| Description |
GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz
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| File Size |
217.63K /
6 Page |
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it Online |
Download Datasheet |
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Micross Components
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| Part No. |
HMC203
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| OCR Text |
...bonds should be thermosonically bonded with a force of 40-60 grams. dc bonds of 0.001 (0.025 mm) diameter, thermosonically bonded, are recommended. ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. a... |
| Description |
Microwave Radio
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| File Size |
755.09K /
7 Page |
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it Online |
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Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC331
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| OCR Text |
...bonds should be thermosonically bonded with a force of 40 - 60 grams. DC bonds of 0.001" (0.025mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40 - 50 grams and wedge bonds at 18 - 22 grams. ... |
| Description |
GaAs MMIC PASSIVE FREQUENCY DOUBLER 12 - 18 GHz INPUT
GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT
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| File Size |
97.77K /
5 Page |
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it Online |
Download Datasheet |
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