| |
|
 |
Bourns, Inc.
|
| Part No. |
PPC403GB-KA28C-1
|
| OCR Text |
...devices is supported for cache fill and flush operations. the biu controls the transfer of data between the external bus and the instruction cache, the data cache, or registers internal to the processor core. the biu also arbitrates amo... |
| Description |
32-Bit Microprocessor 32位微处理
|
| File Size |
364.34K /
44 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Electronic Theatre Controls, Inc.
|
| Part No. |
GILLFAB1367A GILLFAB1076A GILLFAB1366 GILLFAB1367C
|
| OCR Text |
... (19) drum peel note 1 warp fill bms8-223 in-lb/3in (nm / 76.2 mm) n/r n/r n/r n/r 70 (7.91) 55 (6.21) edge bearing warp fill bms8-223 psi (n/mm 2 ) psi (n/mm 2 ) 49,067 (338) 46,067 (318) 51,955 (358) 4... |
| Description |
a light weight, high impact resistant, low smoke and toxicity, fiberglass reinforced phenolic laminate 重量轻，耐冲击，低烟雾和毒性，玻璃纤维增强酚醛层压
|
| File Size |
109.83K /
3 Page |
View
it Online |
Download Datasheet |
| |
|
|
Electronic Film Capacitors
|
| Part No. |
SP1213
|
| OCR Text |
...pylene capacitors in a wrap and fill construction. special metallization and high-tech terminations allow these capacitors to operate at up to 30 amps ripple current at frequencies up to 100 khz. sp1213 exhibit little or no capacitance ro... |
| Description |
METALLIZED POLYPROPYLENE
|
| File Size |
53.16K /
4 Page |
View
it Online |
Download Datasheet |
| |
|
|
SGS Thomson Microelectronics
|
| Part No. |
AN1015
|
| OCR Text |
...completely. For extra security, fill the unused memory locations with code that forces a watchdog reset or jumps to a known program location if you do not want to generate a reset. This will ensure that even if the program counter is corrup... |
| Description |
MCUS - SOFTWARE TECHNIQUES FOR IMPROVING MICROCONTROLLER EMC PERFORMANCE
|
| File Size |
89.73K /
14 Page |
View
it Online |
Download Datasheet |
| |
|
|
Silicon Laboratories Inc.
|
| Part No. |
SI3200-FS SI3200-BS SI3200-GS SI3200-KS
|
| OCR Text |
...-designed PCB heat slug (copper fill) structure under the Si3200 package. The heat slug must be, as much as possible, contiguous with the system GND fill on the top circuit layer underneath the Si3200 package. The heat slug should be connec... |
| Description |
|
| File Size |
76.40K /
8 Page |
View
it Online |
Download Datasheet |
| |
|
|
Motorola
|
| Part No. |
MCF5272
|
| OCR Text |
... a bit stuffed HDLC packet HDLC_fill_WITH_FLAGS--fill the output buffer completely with flags HDLC_fill_WITH_ONES--fill the output buffer completely with ones NOTE The HDLC_Tx_Driver function must be called with HDLC_INIT_CHANNEL before a c... |
| Description |
Users Guide
|
| File Size |
113.56K /
28 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
|
