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ON Semi
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Part No. |
MBRM140T3_D ON0459
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OCR Text |
...mately) * Device Marking: BCJ * Lead and Mounting Surface Temperature for Soldering Purposes. 260C Maximum for 10 Seconds MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Recti... |
Description |
1.0 AMPERES 40 VOLTS From old datasheet system
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File Size |
134.63K /
4 Page |
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ON Semi
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Part No. |
MBRM140T3 ON0460
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OCR Text |
...roximately) Device Marking: BCJ Lead and Mounting Surface Temperature for Soldering Purposes. 260C Maximum for 10 Seconds
Mechanical Characteristics:
ORDERING INFORMATION
Device MBRM140T3
This document contains information on a new ... |
Description |
1.0 AMPERES 40 VOLTS From old datasheet system
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File Size |
157.84K /
8 Page |
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it Online |
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ONSEMI ON Semiconductor
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Part No. |
NTF6P02T3 NTF6P02T3-D NTF6P02T3G NTF6P02T3/D
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OCR Text |
...hermal Resistance - Junction to Lead (Note 1) - Junction to Ambient (Note 2) - Junction to Ambient (Note 3) Maximum Lead Temperature for Sol...MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board la... |
Description |
Receptacle With A Wire Wrap Tail NTF6P02T3 Power MOSFET -6.0 Amps, -20 Volts P?Channel SOT23(-6.0A,-20V,P通道,SOT-23封装的功率MOSFET) 10 A, 20 V, 0.05 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-261AA Power MOSFET -6.0 Amps, -20 Volts P??annel SOT?23 Power MOSFET -6.0 Amps, -20 Volts P-Channel SOT-223 20V P-ch HD3e SOT223
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File Size |
67.74K /
8 Page |
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it Online |
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ON Semi
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Part No. |
MGSF3441VT1_D ON1898 ON1897
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OCR Text |
... -- Junction-to-Ambient Maximum Lead Temperature for Soldering Purposes, for 10 seconds Symbol VDSS VGS ID IDM PD TJ, Tstg RJA TL Value 20 ...MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board l... |
Description |
From old datasheet system P-CHANNEL ENHANCEMENT?ODE
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File Size |
136.51K /
6 Page |
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it Online |
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ONSEMI[ON Semiconductor]
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Part No. |
MPN3700 MMBV3700LT1
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OCR Text |
... of solder used was 62/36/2 Tin Lead Silver with a melting point between 177-189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heate... |
Description |
High Voltage Silicon Pin Diodes
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File Size |
53.62K /
8 Page |
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it Online |
Download Datasheet
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Price and Availability
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