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12864F MM1566 LTC1662C DS2422S LTC1662C NTE5953 LA1600 74AHC1
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For lift Found Datasheets File :: 509    Search Time::1.453ms    
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    FH18-21S-0.3SHW FH18-51S-0.3SHW FH18-17S-0.3SHW FH18-25S-0.3SHW FH18-27S-0.3SHW FH18-39S-0.3SHW FH18-45S-0.3SHW

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HIROSE[Hirose Electric]
Hirose Electric USA, INC.
Part No. FH18-21S-0.3SHW FH18-51S-0.3SHW FH18-17S-0.3SHW FH18-25S-0.3SHW FH18-27S-0.3SHW FH18-39S-0.3SHW FH18-45S-0.3SHW
OCR Text ...tor installed on the board. 1) lift up the actuator. Use thumb or index finger. 2) Rotate down the actuator until firmly closed. It is critical that the inserted FPC is not moved and remains fully inserted. Should the FPC be moved, open...
Description Low Profile 0.3mm Pitch Connectors For FPC

File Size 272.76K  /  8 Page

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    LA2900 LA2900M

Sanyo Semicon Device
Part No. LA2900 LA2900M
OCR Text ...k Diagram 36k 2 36k 19 24k -lift + 18 AMP VCC C10 1.5F + C9 100F C11 0.1F + -- 4 + -30k + SIG -AMP VREF OUT1 16 + C8 22F RL 10k C5 100F ILA00765 C1 22F + + 3 220 C7 1.5F 17 VIN1 5 24k 14 9 36k 12 24k -L...
Description Two-Channel High-Output Line Amplifier for Car Audio Systems

File Size 39.26K  /  5 Page

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    LA2902V

Sanyo Semicon Device
Part No. LA2902V
OCR Text ...Vrms dB dB k Pin Assignment lift R OUT lift L OUT lift R VD lift L VD RR OUT 13 Top view 1 LF IN-2 LF IN+ 3 N.C 4 LR IN-5 LR IN+ 6 DC L 7 DC R 8 RF IN+ 9 RF IN-10 N.C 11 RR IN+ 12 RR IN-- 24 23 22 21 20 19 18 17 ...
Description AF Preamplifiers: High output 4-channel line amplifier IC for car audio system, radically reduced number of required extemal components
Four-Channel High-Output Line Amplifier for Car Audio Systems

File Size 58.54K  /  5 Page

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    IXYS, Corp.
IXYS[IXYS Corporation]
Part No. L034 VMO380-02F
OCR Text ...er supplies DC choppers in fork lift trucks nA Advantages q q q q 2,5 mA 12 mA 4.6 m VGS = 10 V, ID = 0.5 * ID25 Pulse test, t 300 s, duty cycle d 2 % Easy to mount Space and weight savings High power density Low losses IX...
Description MegaMOSTMFET Module MegaMOSTMFET模块

File Size 77.65K  /  4 Page

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    LG
Part No. RE29FA31PX
OCR Text ...ndling the Picture Tube. Do not lift the Picture tube by it's Neck. Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc...
Description (RE29FA33/31) Color TV Service Manual

File Size 2,465.75K  /  41 Page

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    ST Microelectronics
Part No. 6847 C20 C30
OCR Text ...ngs Die shear force < 10 N Wire lift or broken at pull test with < 4 g 2 31 41 Chip covering Die bond strength Wire bonding Note: 1. Test 3 and 4 are conducted in accordance with MIL-STD-833. 4/13 MICROMODULES RELIABILITY Pr...
Description MEMORY MICROMODULES GENERAL INFORMATION FOR D1, D2 AND C PACKAGING
From old datasheet system

File Size 1,163.90K  /  13 Page

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    MAXIM - Dallas Semiconductor
Part No. MAX3289EVKIT-MAX3299EVKIT MAX3289EVKIT MAX3299EVKIT
OCR Text ...pick, heat each lead and gently lift it from its pad, being careful not to damage the underlying trace. 3) Flip the board over and notice that there is a hole underneath the exposed pad of the MAX3289 in the middle of the thermal pad. Place...
Description Evaluation Kit for the MAX3289/MAX3299
From old datasheet system

File Size 184.88K  /  8 Page

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    RA13H8891MA RA13H8891MA-101

Mitsubishi Electric Semiconductor
Part No. RA13H8891MA RA13H8891MA-101
OCR Text ... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=13W, VDD=12.5V and Pin=200mW each stage transistor operating conditions are: Pin IDD @ T=30% VDD Pout Rth(ch-case) Stage (C/W) (A) (W) (W) (V...
Description 889-915MHz 13W 12.5V, 2 Stage Amp. For MOBILE RADIO

File Size 92.59K  /  8 Page

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