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  mold-less Datasheet PDF File

For mold-less Found Datasheets File :: 2647    Search Time::2.828ms    
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    CS8182-D

ON Semiconductor
Part No. CS8182-D
OCR Text ...imension d and e do not include mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include dambar protrusion. allowable dambar protrusion shall be 0.127 total in excess of the b dimension at maximum material ...
Description Micropower 200 mA Low Dropout Tracking Regulator/Line Driver

File Size 75.58K  /  8 Page

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    NB2305AC1HDR2G NB2305AI1DG NB2305AI1DR2G NB2305AI1DTG NB2305AI1DTR2G NB2305AC1DG NB2305AC1DR2G NB2305AC1DTG NB2305AC1DTR

ONSEMI[ON Semiconductor]
Part No. NB2305AC1HDR2G NB2305AI1DG NB2305AI1DR2G NB2305AI1DTG NB2305AI1DTR2G NB2305AC1DG NB2305AC1DR2G NB2305AC1DTG NB2305AC1DTR2G NB2305AI1HDTR2G NB2305A NB2305AC1HDG NB2305AC1HDTG NB2305AC1HDTR2G NB2305AI1HDG NB2305AI1HDR2G NB2305AI1HDTG
OCR Text ...IMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT M...
Description 3.3 V Zero Delay Clock Buffer

File Size 130.68K  /  8 Page

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    PS21962-4S PS21962-4S09

Mitsubishi Electric Semiconductor
Part No. PS21962-4S PS21962-4S09
OCR Text MOLD TYPE INSULATED TYPE PS21962-4S INTEGRATED POWER FUNCTIONS 600V/5A low-loss 5th generation IGBT inverter bridge for three phase D...less than 1ms TC = 25C, per 1 chip (Note 1) Ratings 450 500 600 5 10 21.3 -20~+125 Unit V V V A A W ...
Description Dual-In-Line Package Intelligent Power Module
600V/5A low-loss 5th generation IGBT inverter bridge for three phase DC-to-AC power conversion

File Size 127.03K  /  8 Page

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    UPG152TA UPG152TA-E3

NEC[NEC]
Part No. UPG152TA UPG152TA-E3
OCR Text ...oused in as original 6 pin mini-mold that is smaller than usual 8 pin SSOP and easy to install and contributes to miniaturizing the system. ...less than 100 pF. 4 The distance between IC's GND pin and ground pattern of substrate should be as s...
Description    L-BAND SPDT SWITCH

File Size 81.15K  /  12 Page

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    UPG173TA UPG173TA-E3

NEC[NEC]
Part No. UPG173TA UPG173TA-E3
OCR Text ...used in a very small 6 pin mini-mold package available on tape-and-reel and easy to install and contributes to miniaturizing the systems. ...less than 260C, Hour: within 10 s. Note Time: 1 time, Limited days: no. Pin area temperature: less t...
Description L-BAND PA DRIVER AMPLIFIER

File Size 74.28K  /  8 Page

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    UPG175TA UPG175TA-E3

NEC[NEC]
Part No. UPG175TA UPG175TA-E3
OCR Text ...AGC = 0.5 to 2.5 V * 6 pin mini-mold package APPLICATION * Digital Cellular: PDC800M, etc. ORDERING INFORMATION (PLAN) PART NUMBER P...less than 260C, Hour: within 10 s. Note Time: 1 time, Limited days: no. Pin area temperature: less t...
Description L-Band PA DRIVER AMPLIFIER

File Size 60.29K  /  8 Page

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    CS8221YDFR8 CS8221YDPR3 CS8221 CS8221YDF8 CS8221YDFR8G CS8221YDP3

ONSEMI[ON Semiconductor]
Part No. CS8221YDFR8 CS8221YDPR3 CS8221 CS8221YDF8 CS8221YDFR8G CS8221YDP3
OCR Text ...IMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT M...
Description Micropower 5.0 V, 100 mA Low Dropout Linear Regulator

File Size 71.61K  /  7 Page

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    Mitsubishi Electric Corporation
Part No. PS21246-E
OCR Text ... PS21246-E PS21246-E TRANSFER-MOLD TYPE TRANSFER-MOLD TYPE INSULATED TYPE INSULATED TYPE PS21246-E INTEGRATED POWER FUNCTIONS 4th g...less than 100ns) diodes should be used in the bootstrap circuit. VNC VD (15V line) Fig. 3 EXTE...
Description DIP - IPM

File Size 170.11K  /  9 Page

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    FAIRCHILD[Fairchild Semiconductor]
Part No. RV4145A_04 RV4145A RV4145AM RV4145AMT RV4145AN RV4145A04
OCR Text ... 2. "D" and "E1" do not include mold flashing. Mold flash or protrusions shall not exceed .010 inch (0.25mm). 3. Terminal numbers are for reference only. 4. "C" dimension does not include solder finish thickness. 5. Symbol "N" is the maximu...
Description    Low Power Ground Fault Interrupter
Low Power Ground Fault Interrupt Controller

File Size 82.62K  /  10 Page

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    PS21963-4ES PS21963-4ES09

Mitsubishi Electric Semiconductor
Part No. PS21963-4ES PS21963-4ES09
OCR Text MOLD TYPE INSULATED TYPE PS21963-4ES INTEGRATED POWER FUNCTIONS 600V/8A low-loss CSTBT TM inverter bridge for three phase DC-to-AC po...less than 1ms TC = 25C, per 1 chip (Note 1) Ratings 450 500 600 8 16 24.3 -20~+125 Unit V V V A A W ...
Description Dual-In-Line Package Intelligent Power Module
600V/8A low-loss CSTBTTM inverter bridge for three phase DC-to-AC power conversion

File Size 126.97K  /  8 Page

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For mold-less Found Datasheets File :: 2647    Search Time::2.828ms    
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