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pitch wire-to-board Datasheet PDF File

For pitch wire-to-board Found Datasheets File :: 19253 Search Time::2.718ms
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				http:// INFINEON[Infineon Technologies AG]
Part No.	HYB18L2561 HYE25L256160AC-7.5 HYE25L256160AF-7.5 HYB18L256160BC-7.5 HYB18L256160BF-7.5 HYB25L256160AC-7.5 HYB39L256160AC-7.5 HYE25L128160AC-7.5 HYB18L128160BC-7.5 HYB18L128160BF-7.5 HYB25L128160AC-7.5 HYB25L256160AF-7.5 HYB25L512160AC-7.5 HYB39L128160AT HYB39L128160AT-7.5 HYB39L256160AT-7.5 HYE18L256160BC-7.5 HYE18L128160BC-7.5 HYB39L128160AC-7.5 HYE18L256160BF-7.5 HYE18L128160BF-7.5 HYB18L256160BC-75 HYB18L256160BF-75 HYB18L128160BC-75 HYB18L128160BF-75 HYE18L256160BF-75 HYE18L128160BC-75
OCR Text	... M D E V I C E S come in a Fine-pitch Ball Grid Array (FBGA) package. These packages leverage Infineon's proprietary wire bonding Board-On-Chip (BOC) technology for smallest form factors. The latest product generation further improves form ...
Description	HEX DIE SET,.052/.068/.100/.21 RT ANG PCB CONT .40/1.295 BULK BJAWBMSpecialty DRAMs Mobile-RAM BJAWBMSpecialty DRAM的移动RAM
File Size	568.51K / 6 Page	View it Online	Download Datasheet

				AKM
Part No.	AK4538
OCR Text	...4538VN AKD4538 52pin QFN (0.4mm pitch) -10 +70C Evaluation board for AK4538 n Pin Layout (52pin QFN) AUXIN+ BEEPM BEEPR MOUT...wire Serial Audio Serial Data Input Pin Audio Serial Data Output Pin Input / Output Channel Clock Pi...
Description	CODEC
File Size	449.54K / 69 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics STMICROELECTRONICS[STMicroelectronics]
Part No.	CB35000SERIES CB35000 2633 CB35000-SERIES
OCR Text	...s the Metal 2 minimum contacted pitch, the vertical wiring can be done on every grid point, without limitation. TECHNOLOGY OVERVIEW A major ...Wire bond pad spacings for 80 micron centres are available where large signal counts are most import...
Description	HCMOS STANDARD CELLS From old datasheet system
File Size	164.82K / 16 Page	View it Online	Download Datasheet

				STMicroelectronics N.V. 意法半导 STMICROELECTRONICS[STMicroelectronics] SGS Thomson Microelectronics ST Microelectronics
Part No.	ISB35000SERIES ISB35666 ISB35000 ISB35832 ISB35083 ISB35130 ISB35166 ISB35208 ISB35279 ISB35389 ISB35484
OCR Text	... the I/O where the pad size and pitch is not determined until the customers choice of packaging, signal interface standards and I/O count is considered. Wire bond pad spacings for 80 micron centres are available where large signal counts ar...
Description	HCMOS STRUCTURED ARRAY HCMOS结构化阵
File Size	344.08K / 15 Page	View it Online	Download Datasheet

				Maxim
Part No.	MAX9962
OCR Text	...in, 14mm x 14mm body, and 0.5mm pitch TQFP. An exposed 8mm x 8mm die pad on the top (MAX9961) or bottom (MAX9962) of the package facilitates...wire, low-voltage, CMOS-compatible serial interface programs the low-leakage, load calibration, slew...
Description	Dual, Low-Power, 500Mbps ATE Drivers/Comparators with 2mA Load
File Size	427.58K / 28 Page	View it Online	Download Datasheet

				nec
Part No.	UPD780306
OCR Text	...kage 100-pin plastic LQFP (Fine pitch) (14 x 14 mm) 100-pin plastic QFP (14 x 20 mm) 100-pin plastic LQFP (Fine pitch) (14 x 14 mm) 100-pin ...wire serial I/O/SBI/2-wire serial I/O mode selectable : 1 channel 3-wire serial I/O/UART mode select...
Description	IC,MICROCONTROLLER,8-BIT,UPD78K0 CPU,CMOS,QFP,100PIN,PLASTIC
File Size	432.44K / 70 Page	View it Online	Download Datasheet

				Zarlink
Part No.	SL2015
OCR Text	...upply connector is a 3 pin 0.1" pitch pin header. The centre pin of the connector is GND. The synthesiser must be programmed to 1020.5MHz...wire bus interface box. Input and Output connections The board is provided with the following co...
Description	Full Band Satellite Tuner
File Size	481.51K / 17 Page	View it Online	Download Datasheet

				JST
Part No.	RA-3011
OCR Text	...d vibration. 2.54mm (.100") pitch * Housing lances The contact retention lances on the resilient housing allow visual confirmation o...wire: AWG #26 to #22 * Applicable PC board thickness: 1.6mm(.063") * Contact JST for details. 81 ...
Description	Header, Cable Mount
File Size	98.08K / 2 Page	View it Online	Download Datasheet

				意法半导 STMICROELECTRONICS[STMicroelectronics] ST Microelectronics SGS Thomson Microelectronics
Part No.	CB45000 CB45000SERIES 5813 CB45000-SERIES
OCR Text	... itself is variable in terms of pitch and size and even supports staggered bonding methodologies. This is becoming far more I/O BUFFER LI...Wire bond pad spacings down to 65 and 50 centres will released in the near future to support large s...
Description	From old datasheet system HCMOS6 STANDARD CELLS
File Size	264.34K / 16 Page	View it Online	Download Datasheet

				AKM[Asahi Kasei Microsystems]
Part No.	AK4117 AK4117VF
OCR Text	... -40 ~ +85 C 24pin VSOP (0.65mm pitch) Pin Layout R AVDD RX1 NC RX0 DVDD DVSS XTI XTO LRCK BICK SDTO 1 2 3 4 5 6 7 8 9 10 11 12 ...wire P interface pins: CSN, CCLK, CDTI & CDTO. The data on this interface consists of Chip address (...
Description	24-bit 192kHz 2channel S/PDIF receiver LOW POWER 192KHZ DIGITAL AUDIO RECEIVER
File Size	339.92K / 36 Page	View it Online	Download Datasheet

For pitch wire-to-board Found Datasheets File :: 19253 Search Time::2.718ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |

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