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  S-8232 Datasheet PDF File

For S-8232 Found Datasheets File :: 74+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | <7> | 8 |   

    RCB1823500KZF RCB1823501KZF RCB1823250KZF RCB1823101KZF RCB1823102KZF RCB1823251KZF RCB1823100MZF RCB1823

Superworld Electronics
Part No. RCB1823500KZF RCB1823501KZF RCB1823250KZF RCB1823101KZF RCB1823102KZF RCB1823251KZF RCB1823100MZF RCB1823
Description    RADIAL CHOKE COIL
File Size 589.13K  /  4 Page

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Amphenol Communications Solutions
Part No. 89882-324LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Single row ,24 Positions, 2.54mm (0.100in) Pitch
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    SWITCHCRAFT INC
Part No. PL103201X PL626208X PL329203X PL103703X PL106703X PL106203X PL412205X PL103212X L709712X L612200X PL823205X PL823700X PL823212X PL823200X PL206712X
Description PUSHBUTTON SWITCH, SPDT, MOMENTARY, PANEL MOUNT
PUSHBUTTON SWITCH, DPDT, MOMENTARY, PANEL MOUNT
PUSHBUTTON SWITCH, 3PDT, MOMENTARY, PANEL MOUNT
PUSHBUTTON SWITCH, SPDT, LATCHED, PANEL MOUNT
PUSHBUTTON SWITCH, DPDT, LATCHED, PANEL MOUNT
PUSHBUTTON SWITCH, 4PDT, MOMENTARY, PANEL MOUNT
PUSHBUTTON SWITCH, 3PDT, LATCHED, THROUGH HOLE-STRAIGHT
PUSHBUTTON SWITCH, SPDT, MOMENTARY, THROUGH HOLE-STRAIGHT
PUSHBUTTON SWITCH, SPDT, LATCHED, THROUGH HOLE-STRAIGHT
File Size 203.45K  /  1 Page

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Amphenol Communications Solutions
Part No. 68682-328LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 56 Position ,2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    593-232326-002-F 593-232320-002-F 593-232323-002-F 593-232324-002-F 593-292420-002-F 593-202320-002-F 593-232020-002-F 5

Dialight Corporation
Part No. 593-232326-002-F 593-232320-002-F 593-232323-002-F 593-232324-002-F 593-292420-002-F 593-202320-002-F 593-232020-002-F 593-232023-002-F 593-232024-002-F 593-232026-002-F 593-232420-002-F 593-232423-002-F 593-232424-002-F 593-232620-002-F 593-282924-002-F 593-282920-002-F 593-282923-002-F 593-202423-002-F 593-242323-002-F 593-242324-002-F 593-242320-002-F 593-242923-002-F 593-202324-002-F 593-262420-002-F 593-292820-002-F 593-292823-002-F 593-292824-002-F 593-262920-002-F 593-262923-002-F 593-242020-002-F 593-242023-002-F 593-242024-002-F 593-242026-002-F 593-242420-002-F 593-242423-002-F 593-242424-002-F 593-242620-002-F 593-242623-002-F 593-242624-002-F 593-242823-002-F 593-242824-002-F 593-242920-002-F 593-242924-002-F 593-232623-002-F 593-202020-002F 593-202023-002-F 593-202024-002-F 593-202026-002-F 593-202323-002-F 593-282020-002-F 593-282023-002-F 593-282024-002-F 593-282026-002-F 593-282320-002-F 593-282323-002-F 593-282324-002-F 593-282420-002-F 593-282423-002-F 593-282424-002-F 593-282620-002-F 593-282623-002-F 593-282624-002-F 593-282820-002-F 593-232823-002-F 593-202823-002-F 593-282823-002-F 593-262823-002-F 593-202420-002-F 593-202620-002-F 593-202326-002-F 593-202424-
Description 3mm Tri-level Prism CBI Surface Mount LED SINGLE COLOR
File Size 136.19K  /  2 Page

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Amphenol Communications Solutions
Part No. 76382-323LF
Description Dubox®2.54mm, Board to Board Connector, Shrouded Header, Single Row, Right Angle.
Tech specs 　 　

Official Product Page

    TSOP17..XG1 TSOP1730XG102 UC1682XFBZ UPC8232T5N-E2-A XC9511C14SRL XC9511B14SRL XC9511A14SRL XC9511F14SRL XC9511 XC9511A1

Torex Semiconductor, Ltd.
ETC
CEL
TOREX[Torex Semiconductor]
Part No. TSOP17..XG1 TSOP1730XG102 UC1682XFBZ UPC8232T5N-E2-A XC9511C14SRL XC9511B14SRL XC9511A14SRL XC9511F14SRL XC9511 XC9511A143SRL XC9511A146SRL XC9511A14CSRL XC9511B143SRL XC9511B146SRL XC9511B14CSRL XC9511C143SRL XC9511C146SRL XC9511C14CSRL XC9511D143SRL XC9511D146SRL XC9511D14CSRL XC9511D14SRL XC9511E143SRL XC9511E146SRL XC9511E14CSRL XC9511E14SRL XC9511F143SRL XC9511F146SRL XC9511F14CSRL
Description Synchronous Step-Down DC/DC Converter with built-in LDO Regulator in parallel plus Voltage Detector 同步降压型DC / DC转换器内置LDO的同时加电压检测器调节
High Performance 8-bit Microcontroller
HIGH-VOLTAGE MIXED-SIGNAL IC
B IPOLAR ANALOG INTE GR ATE D CIR CUIT
File Size 167.77K  /  13 Page

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Amphenol Communications Solutions
Part No. 65823-217
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header .
Tech specs 　 　

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    Renesas Electronics Corporation.
Renesas Electronics, Corp.
Part No. M38230G4-XXXFP M38230G4-XXXHP M38231G4-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38233G4-XXXFP M38233G4-XXXHP M38234G4-XXXFP M38234G4-XXXHP M38235G4-XXXFP M38230G6-XXXFP M38230G6-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38233G6-XXXFP M38233G6-XXXHP M38234G6-XXXFP M38234G6-XXXHP M38235G6-XXXFP M38235G6-XXXHP M38236G6-XXXHP M38237G6-XXXFP M38237G6-XXXHP M38238G6-XXXFP M38230G7-XXXFP M38230G7-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38233G7-XXXFP M38233G7-XXXHP M38234G7-XXXFP M38234G7-XXXHP M38235G7-XXXFP M38235G7-XXXHP M38236G7-XXXFP M38236G7-XXXHP M38237G7-XXXFP M38237G7-XXXHP M38238G7-XXXFP M38238G7-XXXHP M38239G7-XXXFP M38239G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38233G8-XXXFP M38233G8-XXXHP M38234G8-XXXFP M38234G8-XXXHP M38235G8-XXXFP M38235G8-XXXHP M38236G8-XXXFP M38236G8-XXXHP M38237G8-XXXFP M38237G8-XXXHP M38238G8-XXXFP M38238G8-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38232GA-XXXFP M38232GA-XXXHP M38233GA-XXXFP M38233GA-XXXHP M38234GA-XXXFP M38234GA-XXXHP M38235GA-XXXFP M38235GA-XXXHP M38236GA-XXXFP M38236GA-XXXHP M38237GA-XXXFP M38237GA-XXXHP
Description 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 512Kb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 3.1 to 3.6 V
18-Mbit (512K x 36/1M x 18) Pipelined SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL(TM) Architecture; Architecture: NoBL, Flow-through; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 3.1 to 3.6 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 512Kb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 3.1 to 3.6 V
72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency); Architecture: QDR-II , 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V
72-Mbit DDR-II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency); Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯8位CMOS微机
Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机
72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V
36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
File Size 901.80K  /  76 Page

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Amphenol Communications Solutions
Part No. G8232412YCEU
Description Board mount - Header Plug - Box Header 2.0mm Pitch Vertical,2x12Pin,15u\\ Gold,NY4T,TAIL=2.1mm
Tech specs 　 　

Official Product Page

    M3823AGF-XXXHP 3823 M38230G1-XXXFP M38230G1-XXXHP M38230G2-XXXFP M38230G2-XXXHP M38230G3-XXXFP M38230G3-XXXHP M38230G4-X

RENESAS[Renesas Electronics Corporation]
Part No. M3823AGF-XXXHP 3823 M38230G1-XXXFP M38230G1-XXXHP M38230G2-XXXFP M38230G2-XXXHP M38230G3-XXXFP M38230G3-XXXHP M38230G4-XXXFP M38230G4-XXXHP M38230G5-XXXFP M38230G5-XXXHP M38230G6-XXXFP M38230G6-XXXHP M38230G7-XXXFP M38230G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38230G9-XXXFP M38230G9-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38230GB-XXXFP M38230GB-XXXHP M38230GC-XXXFP M38230GC-XXXHP M38230GD-XXXFP M38230GD-XXXHP M38230GE-XXXFP M38230GE-XXXHP M38230GF-XXXFP M38230GF-XXXHP M38231G1-XXXFP M38231G1-XXXHP M38231G2-XXXFP M38231G2-XXXHP M38231G3-XXXFP M38231G3-XXXHP M38231G4-XXXFP M38231G4-XXXHP M38231G5-XXXFP M38231G5-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38231G9-XXXFP M38231G9-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38231GB-XXXFP M38231GB-XXXHP M38231GC-XXXFP M38231GC-XXXHP M38231GD-XXXFP M38231GD-XXXHP M38231GE-XXXFP M38231GE-XXXHP M38231GF-XXXFP M38231GF-XXXHP M38232G1-XXXFP M38232G1-XXXHP M38232G2-XXXFP M38232G2-XXXHP M38232G3-XXXFP M38232G3-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38232G5-XXXFP M38232G5-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38232G9-XXXFP M38232G9-XXXHP M38232GA-X
Description SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER
File Size 877.42K  /  76 Page

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Amphenol Communications Solutions
Part No. G8232812YBEU
Description Board mount - Header Plug - Box Header 2.0mm Pitch Vertical,2x14Pin,15u\\ Gold,NY4T,TAIL=2.5mm
Tech specs 　 　

Official Product Page

    American Microsemiconductor Inc.
Part No. 3N2013N2023N2033N203A3N2043N205 2N38232N44162N4416A2N5549 BF800BF801BF802BF803BF804 E8517E8517AE8518E8518AE8519E8519A
Description
2N3823 2N4416 2N4416A 2N5549
E8517 E8517A E8518 E8518A E8519 E8519A
File Size 93.58K  /  1 Page

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Amphenol Communications Solutions
Part No. G8232012YC19EU
Description Board mount - Header Plug - Box Header 2.0mm Pitch Vertical,2x10Pin,15u\\ Gold,NY4T,TAIL=2.3mm,Removed#19Pos
Tech specs 　 　

Official Product Page

    KEMET[Kemet Corporation]
Part No. C0402C823RAC C0402C10412RAC C0402C1041RAC C0402C1042RAC C0402C104RAC C0402C12312RAC C0402C1231RAC C0402C1232RAC C0402C123RAC C0402C15312RAC C0402C1531RAC C0402C1532RAC C0402C153RAC C0402C18312RAC C0402C1831RAC C0402C1832RAC C0402C183RAC C0402C22312RAC C0402C2231RAC C0402C2232RAC C0402C223RAC C0402C27312RAC C0402C2731RAC C0402C2732RAC C0402C273RAC C0402C33312RAC C0402C3331RAC C0402C3332RAC C0402C333RAC C0402C3931RAC C0402C3932RAC C0402C393RAC C0402C47312RAC C0402C4731RAC C0402C4732RAC C0402C56312RAC C0402C5631RAC C0402C5632RAC C0402C563RAC C0402C68312RAC C0402C6831RAC C0402C6832RAC C0402C683RAC C0402C82312RAC C0402C8231RAC C0402C8232RAC C0402C39312RAC C0402C473RAC
Description Surface Mount Ceramic Chip Capacitors X7R Dielectric
File Size 27.03K  /  2 Page

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Amphenol Communications Solutions
Part No. 89882-325
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Single row ,25 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    KEMET[Kemet Corporation]
Part No. C1206C8232RAC C1206C10412RAC C1206C1042RAC C1206C12412RAC C1206C1242RAC C1206C12513RAC C1206C1253RAC C1206C15412RAC C1206C1542RAC C1206C15513RAC C1206C1553RAC C1206C27312RAC C1206C2732RAC C1206C27411RAC C1206C27415RAC C1206C2741RAC C1206C2745RAC C1206C33312RAC C1206C3332RAC C1206C33411RAC C1206C33415RAC C1206C3341RAC C1206C3345RAC C1206C39312RAC C1206C3932RAC C1206C39411RAC C1206C39415RAC C1206C3941RAC C1206C3945RAC C1206C47312RAC C1206C4732RAC C1206C47415RAC C1206C4745RAC C1206C56312RAC C1206C5632RAC C1206C56415RAC C1206C5645RAC C1206C68312RAC C1206C6832RAC C1206C68415RAC C1206C6845RAC C1206C82312RAC
Description Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts
File Size 32.13K  /  2 Page

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Amphenol Communications Solutions
Part No. G8232022YDEU
Description Board mount - Header Receptacle - Box Header 2.0mm Pitch Right Angle DIP,2x10Pin,15u\\ Gold,NY4T,Tail=2.2mm,Color-Black,Tray
Tech specs 　 　

Official Product Page

    M22U8235 M15G1002 M15G1012 M15G1021 M15G109D2 M15G1202 M15G1211 M15G1212 M15G1502 M15G1511 M15G1512 M15G159D2 M15G1802 M

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Description    Multilayer Ceramic Capacitors
File Size 35.92K  /  4 Page

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Amphenol Communications Solutions
Part No. G8232612YBPEU
Description Board mount - Header Receptacle - Box Header 2.0mm Pitch Vertical DIP,2x13Pin,15u\\ Gold,NY4T,Tail=2.5mm,With one Post,Color-Black,Tray
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