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  102064-0158 Datasheet PDF File

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    0015800189

Molex Electronics Ltd.
Part No. 0015800189
Description MOLEX Connector

File Size 1,218.56K  /  7 Page

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Texas Instruments

Part No. TPS70158PWPR
Description Dual-Output Low Dropout Voltage Regulators with Power-Up Sequencing for Split-Voltage DSP Systems 20-HTSSOP -40 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800163 15-80-0163

Molex Electronics Ltd.
Part No. 0015800163 15-80-0163
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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Texas Instruments

Part No. TPS70158PWPG4
Description Dual-Output Low Dropout Voltage Regulators with Power-Up Sequencing for Split-Voltage DSP Systems 20-HTSSOP -40 to 125
Tech specs    

Get Free Sample

Official Product Page

    0015800185

Molex Electronics Ltd.
Part No. 0015800185
Description MOLEX Connector

File Size 1,218.47K  /  7 Page

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Texas Instruments

Part No. TPS70158PWP
Description Dual-Output Low Dropout Voltage Regulators with Power-Up Sequencing for Split-Voltage DSP Systems 20-HTSSOP -40 to 125
Tech specs    

Get Free Sample

Official Product Page

    15-80-0143 0015800143

Molex Electronics Ltd.
Part No. 15-80-0143 0015800143
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.47K  /  7 Page

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    0014600158

Molex Electronics Ltd.
Part No. 0014600158
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version D, Back Ribs, Wire Size 24, 3.81μm (150μ) Tin/Lead (SnPb)

File Size 159.55K  /  3 Page

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    0015800721

Molex Electronics Ltd.
Part No. 0015800721
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, Tin (Sn) Plating

File Size 1,218.25K  /  7 Page

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    0015800425

Molex Electronics Ltd.
Part No. 0015800425
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    0015800641

Molex Electronics Ltd.
Part No. 0015800641
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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    0015800369 15-80-0369

Molex Electronics Ltd.
Part No. 0015800369 15-80-0369
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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    0015800663

Molex Electronics Ltd.
Part No. 0015800663
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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