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  1140-2117 Datasheet PDF File

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    Pulse Engineering, Inc.
Part No. PE-51590 PE-92117 PE-92402 PE-92107
Description LT3734 Evaluation Kit
LTC2922 Evaluation Kit
Low Cost Inductors - Bare Coil and Klipmount Series 低成本的电感裸线圈和Klipmount系列

File Size 108.90K  /  2 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    53358-1140

Molex Electronics Ltd.
Part No. 53358-1140
Description 2.00mm (.049) Pitch Mi II Wire-to-Wire Adapter, 11 Circuits, Lead-free

File Size 130.52K  /  2 Page

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Amphenol Communications Solutions

Part No. 10121178-2025LF
Description QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 30 AWG, 2.5 m, PVC jacket
Tech specs    

Official Product Page

    SAMTEC INC
Part No. MTSW-225-27-S-D-1140 MTSW-240-23-T-D-255
Description 50 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER
80 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER

File Size 400.79K  /  2 Page

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Amphenol Communications Solutions

Part No. 88922-117LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Press-Fit, 2 Mod.
Tech specs    

Official Product Page

    1140-4015 0011-40-4015

Molex Electronics Ltd.
Part No. 1140-4015 0011-40-4015
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 10121178-4035LF
Description QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 26 AWG, 3.5 m, PVC jacket
Tech specs    

Official Product Page

    1140-4017 0011-40-4017

Molex Electronics Ltd.
Part No. 1140-4017 0011-40-4017
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 79821-170HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 70 Positions, 2.54 mm Pitch, Vertical, 10.92 mm (0.43 in.) Mating, 5.08 mm (0.2 in.) Tail.
Tech specs    

Official Product Page

    1140-4009 0011-40-4009

Molex Electronics Ltd.
Part No. 1140-4009 0011-40-4009
Description Insulation Punch

File Size 14.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 10121178-4030LF
Description QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 26 AWG, 3.0 m, PVC jacket
Tech specs    

Official Product Page

    1140-4016 0011-40-4016

Molex Electronics Ltd.
Part No. 1140-4016 0011-40-4016
Description Conductor Punch

File Size 11.54K  /  1 Page

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Amphenol Communications Solutions

Part No. 10121178-2020LF
Description QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 30 AWG, 2.0 m, PVC jacket
Tech specs    

Official Product Page

    11-40-2043 1140-2043 0011-40-2043

Molex Electronics Ltd.
Part No. 11-40-2043 1140-2043 0011-40-2043
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 10121178-4015LF
Description QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 26 AWG, 1.5 m, PVC jacket
Tech specs    

Official Product Page

    11-40-2036 1140-2036 0011-40-2036

Molex Electronics Ltd.
Part No. 11-40-2036 1140-2036 0011-40-2036
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. GSB3121171CHR
Description USB 3.2, Type A, Receptacle, Vertical, 9 Pins, Shell Forklock with Nickel Plating, Gold Flash, Dip 3.0mm, Blue High Temperature Housing, Tray Packaging
Tech specs    

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    Molex, Inc.
Part No. 51140-0305
Description 3.96 W/W RETAINER 511400305 INTERCONNECTION DEVICE

File Size 33.77K  /  1 Page

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Amphenol Communications Solutions

Part No. 68021-172
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 72 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

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