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  87759-4415 Datasheet PDF File

For 87759-4415 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-4064

Molex Electronics Ltd.
Part No. 87759-4064
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 420.98K  /  8 Page

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Amphenol Communications Solutions

Part No. 75844-156-40LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3275

Molex Electronics Ltd.
Part No. 87759-3275
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-156-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4075

Molex Electronics Ltd.
Part No. 87759-4075
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-156-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4874

Molex Electronics Ltd.
Part No. 87759-4874
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 75844-150-08LF
Description 75844-150-08LF-HDR STR DOUBLE ROW
Tech specs    

Official Product Page

    87759-4074

Molex Electronics Ltd.
Part No. 87759-4074
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 420.21K  /  8 Page

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Amphenol Communications Solutions

Part No. 75844-150-12LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4274

Molex Electronics Ltd.
Part No. 87759-4274
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.12K  /  8 Page

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Amphenol Communications Solutions

Part No. 75844-156-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4275

Molex Electronics Ltd.
Part No. 87759-4275
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-150-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-7626

Molex Electronics Ltd.
Part No. 87759-7626
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, with Pick-and-Place Cap

File Size 355.91K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-158-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-3015

Molex Electronics Ltd.
Part No. 87759-3015
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.39K  /  6 Page

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Amphenol Communications Solutions

Part No. 68764-415HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-0875

Molex Electronics Ltd.
Part No. 87759-0875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-156-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87759-4415 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | <8> | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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