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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1132 0901361132
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1130 0901361130
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
G832MB130802122HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 4.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold White.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1118 0901361118
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.24K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
G832MC110602122HR
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| Description |
0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 60 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
90136-1110 0901361110
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 10 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
20021221-00020D1LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 20 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021221-00068D4LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 68 Positions, 1.27mm (0.500in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021221-00030T8LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 30 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021221-000A0T8LF
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| Description |
Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 100 Positions, 1.27mm (0.500in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021221-00030C4LF
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| Description |
Minitek127® 1.27mm Wire/Cable-to-Board Connector System, Shrouded vertical header, Surface Mount, Double Row, 30 Positions, 1.27mm (0.500in) Pitch.
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Official Product Page
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Bom2Buy.com
Price and Availability
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