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bonding Datasheet PDF File

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				Hittite Microwave Corporation
Part No.	HMC40509
OCR Text	...he manufacturers schedule. wire bonding ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150 deg. c and a ball bonding force of 40 to 50 grams or wedge bonding fo...
Description	InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 10 GHz
File Size	181.92K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC40408
OCR Text	...e at www.hittite.com mounting & bonding techniques for millimeterwave gaas mmics the die should be attached directly to the ground plane eutectically or with conductive epoxy (see hmc general handling, mounting, bonding note). 50 ohm micro...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED IRM MIXER, 26 - 33 GHz
File Size	246.30K / 8 Page	View it Online	Download Datasheet

				MA-Com MACOM[Tyco Electronics]
Part No.	MASW20000
OCR Text	...+85C) Handling, Mounting and bonding Procedure Handling Precautions Permanent damage to the MASW20000 may occur if the following precautions are not adhered to: A. Cleanliness -- The MASW20000 should be handled in a clean environment. D...
Description	DC-20 GHz GaAs SPDT switch GaAs SPDT Switch DC - 20 GHz
File Size	86.61K / 2 Page	View it Online	Download Datasheet

For bonding Found Datasheets File :: 7119 Search Time::2.641ms
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