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For crack Found Datasheets File :: 594    Search Time::0.969ms    
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    RA30H1317M RA30H1317M-01 RA30H1317M-E01

Mitsubishi Electric Sem...
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
Part No. RA30H1317M RA30H1317M-01 RA30H1317M-E01
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description 135-175MHz 30W 12.5V MOBILE RADIO

File Size 63.63K  /  9 Page

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    RA30H3340M RA30H3340M-01 RA30H3340M-E01

Mitsubishi Electric, Corp.
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA30H3340M RA30H3340M-01 RA30H3340M-E01
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when screwing or later when thermal expansion forces are added). Thermal compound between module and heat sink is recommended for low thermal contact resistance and...
Description MITSUBISHI RF MOSFET MODULE 三菱射频MOSFET模块

File Size 71.36K  /  9 Page

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    RA30H4452M RA30H4452M-01 RA30H4452M-E01

Mitsubishi Electric Semicon...
Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric, Corp.
Part No. RA30H4452M RA30H4452M-01 RA30H4452M-E01
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when screwing or later when thermal expansion forces are added). Thermal compound between module and heat sink is recommended for low thermal contact resistance and...
Description 440-520MHz 30W 12.5V MOBILE RADIO 440 - 520MHz的功0W 12.5V移动通信

File Size 87.29K  /  9 Page

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    Motorola, Inc.
MOTOROLA[Motorola, Inc]
ON Semi
Part No. MBRF20200CT_D MBRF20200CT ON0449
OCR Text .... lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. Additional tests on slotted 4-40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting th...
Description SWITCHMODESchottky Power Rectifirer
SWITCHMODE⑩ Schottky Power Rectifirer
From old datasheet system
SWITCHMODE Schottky Power Rectifirer
20 AMPERES 150 and 200 VOLTS

File Size 80.40K  /  4 Page

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    Motorola, Inc.
MOTOROLA[Motorola, Inc]
ON Semi
Part No. MBRF745_D ON0453 MBRF745
OCR Text .... lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. Additional tests on slotted 4-40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting th...
Description SWITCHMODESchottky Power Rectifirer
SWITCHMODE⑩ Schottky Power Rectifirer
From old datasheet system
7.5 AMPERES 45 VOLTS
SWITCHMODE Schottky Power Rectifirer

File Size 75.17K  /  4 Page

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    MJF15030 ON2046 MJF15031

ON Semiconductor
Motorola, Inc
Part No. MJF15030 ON2046 MJF15031
OCR Text .... lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability. Additional tests on slotted 4-40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting th...
Description From old datasheet system
COMPLEMENTARY SILICON POWER TRANSISTORS 8 AMPERES 150 VOLTS 36 WATTS

File Size 245.98K  /  6 Page

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    NFSW036BT NFSW036B

List of Unclassifed Manufacturers
ETC[ETC]
N.A.
Part No. NFSW036BT NFSW036B
OCR Text ...ting LED with solder to avoid a crack of LED package. Refer to the following recommended position and direction of LED. No good Recommended Direction Cathode mark Cathode mark Appropriate LED mounting is to place perpendicularly agai...
Description SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED

File Size 706.32K  /  14 Page

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    RA07H3340M RA07H3340M-E01 RA07H3340M-01

Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA07H3340M RA07H3340M-E01 RA07H3340M-01
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description MITSUBISHI RF MOSFET MODULE 330-400MHz 7W 12.5V PORTABLE/ MOBILE RADIO
From old datasheet system

File Size 61.64K  /  9 Page

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    RA08N1317M RA08N1317M-01 RA08N1317M-E01

Mitsubishi Electric Corporation
MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA08N1317M RA08N1317M-01 RA08N1317M-E01
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description Anti-Static Storage Bags; External Height:6"; External Width:4"; Features:Zipper closure, amine-free, noncorrosive; Material:Vapor-Coated Alum. Shield Bonded between Polyester Outer & Polyethylene Inner Layers RoHS Compliant: NA
Anti-Static Storage Bags; External Height:10"; External Width:6"; Features:Zipper closure, Amine-free, noncorrosive; Material:Vapor-Coated Alum. Shield Bonded between Polyester Outer & Polyethylene Inner Layers RoHS Compliant: NA
135-175MHz 8W 9.6V PORTABLE RADIO

File Size 61.86K  /  9 Page

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    MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No. RA20H8994M-E01 RA20H8994M-01 RA20H8994M
OCR Text ...amic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resist...
Description 896-902/ 935-941MHz 20W 12.5V, 3 Stage Amp. For MOBILE RADIO
896-902/ 935-941MHz 20W 12.5V 3 Stage Amp. For MOBILE RADIO

File Size 64.64K  /  8 Page

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For crack Found Datasheets File :: 594    Search Time::0.969ms    
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