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CM160 TS965C6R MCP1652 CFAPPBL1 TXV2N 7K181 74LVC2 TXV2N
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For irons Found Datasheets File :: 430    Search Time::1.266ms    
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    2SA2151A

Allegro MicroSystems
Part No. 2SA2151A
OCR Text ...products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. The products should always be stored and transported in our shipping container...
Description Audio Amplification Transistor

File Size 276.26K  /  7 Page

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    2SA2151

Allegro Micro Systems, Inc.
Allegro MicroSystems
Part No. 2SA2151
OCR Text ...products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. The products should always be stored and transported in our shipping container...
Description Audio Amplification Transistor

File Size 276.14K  /  7 Page

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    UAA2016P UAA2016-D

ON Semiconductor
Part No. UAA2016P UAA2016-D
OCR Text ...ystems such as panel heaters or irons. A built-in digital sawtooth waveform permits proportional temperature regulation action over a 1C band around the set point. For energy savings there is a programmable temperature reduction function, a...
Description Zero Voltage Switch Power Controller
From old datasheet system

File Size 87.77K  /  8 Page

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    540R2GBC-CA

HB Electronic Components
Part No. 540R2GBC-CA
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description 5.0 mm DIA LED LAMP

File Size 394.92K  /  8 Page

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    540R2GBC-CC

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HB Electronic Components
赫备国际贸易(上海)有限公司
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Part No. 540R2GBC-CC
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description 5.0 mm DIA LED LAMP

File Size 364.20K  /  8 Page

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    560MW7C

HB Electronic Components
Part No. 560MW7C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description LED SPECIFICATION

File Size 773.36K  /  10 Page

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    560MW7D

HB Electronic Components
Part No. 560MW7D
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description LED SPECIFICATION

File Size 801.36K  /  10 Page

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    980PR2C

HB Electronic Components
Part No. 980PR2C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description FLUX LED SPECIFICATION

File Size 625.83K  /  9 Page

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    AGM1264K

AZ Displays
Part No. AGM1264K
OCR Text ...for assembly, such as soldering irons, must be properly grounded. To prevent destruction of the elements by static electricity be careful to maintain an optimum work environment. Do not forcibly pull or bend the I/O cable. Do not disassembl...
Description SPECIFICATIONS FOR LIQUID CRYSTAL DISPLAY

File Size 926.77K  /  13 Page

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    TIANMA
Part No. TM19264ABC
OCR Text ...for assembly, such as soldering irons, must be properly ground. c. To reduce the amount of static electricity generated, do not conduct assembly and other work under dry conditions. d. The LCD Module is coated with a film to protect the dis...
Description LCD_Module

File Size 327.89K  /  22 Page

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