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				Mitsubishi Electric Semiconductor
Part No.	RA13H8891MB RA13H8891MB-101
OCR Text	... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=13W, VDD=12.5V and Pin=1mW each stage transistor operating conditions are: Pin IDD @ T=35% VDD Pout Rth(ch-case) Stage (C/W) (A) (W) (W) (V) ...
Description	RoHS Compliance , 880-915MHz 13W 12.5V, 3 Stage Amp. For MOBILE RADIO
File Size	99.01K / 8 Page	View it Online	Download Datasheet

				Mitsubishi Electric Sem... MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA07H4047M-101 RA07H4047M06 RA07H4047M_06 RA07H4047M
OCR Text	... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=12.5V and Pin=20mW each stage transistor operating conditions are: IDD @ T=40% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) ...
Description	RoHS Compliance ,400-470MHz 7W 12.5V, 2 Stage Amp. For PORTABLE RADIO
File Size	100.44K / 8 Page	View it Online	Download Datasheet

				Mitsubishi Electric Semicon... MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA07H4452M-101 RA07H4452M06 RA07H4452M_06 RA07H4452M
OCR Text	... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=12.5V and Pin=20mW each stage transistor operating conditions are: IDD @ T=40% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) ...
Description	RoHS Compliance ,440-520MHz 7W 12.5V, 2 Stage Amp. For PORTABLE RADIO
File Size	91.23K / 8 Page	View it Online	Download Datasheet

				Mitsubishi Electric Sem... MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA07N3340M-101 RA07N3340M06 RA07N3340M
OCR Text	... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=9.6V and Pin=20mW each stage transistor operating conditions are: IDD @ T=43% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A) s...
Description	RoHS Compliance , 330-400MHz 7.5W 9.6V 2 Stage Amp. For PORTABLE RADIO
File Size	91.55K / 8 Page	View it Online	Download Datasheet

				Mitsubishi Electric Sem... Mitsubishi Electric Semiconductor Mitsubishi Electric Corporation
Part No.	RA07N3340M RA07N3340M-01
OCR Text	... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=7W, VDD=9.6V and Pin=20mW each stage transistor operating conditions are: Pin Pout Rth(ch-case) IDD @ T=43% VDD Stage (W) (W) (C/W) (A) (V) s...
Description	330-400MHz 7.5W 9.6V 2 Stage Amp. For PORTABLE RADIO
File Size	82.45K / 9 Page	View it Online	Download Datasheet

				Mitsubishi Electric Sem... MITSUBISHI[Mitsubishi Electric Semiconductor]
Part No.	RA35H1516M-101 RA35H1516M06 RA35H1516M RA35H1516M-06
OCR Text	... the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=40W, VDD=12.5V and Pin=50mW each stage transistor operating conditions are: IDD @ T=50% VDD Pout Rth(ch-case) Pin Stage (W) (W) (V) (C/W) (A)...
Description	RoHS Compliance , 154-162MHz 40W 12.5V, 2 Stage Amp. For MOBILE RADIO
File Size	84.93K / 8 Page	View it Online	Download Datasheet

				AZ Displays, Inc. AZDISPLAYS[AZ Displays]
Part No.	ATP0574-1
OCR Text	...hem. Do not stress, pile, bend, lift by the cable or put any stress on the film, for example moving by film face vacuum. In order to clean wring dry a cloth which has been emersed in a natural detergent. DO NOT use any organic solvent, acid...
Description	SPECIFICATIONS FOR STANDARD RESISITIVE TOUCH PANEL
File Size	863.29K / 7 Page	View it Online	Download Datasheet

				AZ Displays, Inc. AZDISPLAYS[AZ Displays]
Part No.	ATP0644-3
OCR Text	...hem. Do not stress, pile, bend, lift by the cable or put any stress on the film, for example moving by film face vacuum. In order to clean wring dry a cloth which has been emersed in a natural detergent. DO NOT use any organic solvent, acid...
Description	SPECIFICATIONS FOR STANDARD RESISTIVE TOUCH PANEL
File Size	916.39K / 7 Page	View it Online	Download Datasheet

				ETC[ETC]
Part No.	B-1662436 B-166 B-1661824 B-1661830 B-1661836
OCR Text	...mm). 6. For sufficient space to lift mirror onto wall hanger(s), provide 3-1/4'' (85mm) minimum clearance above center line of mounting screw holes. 7. Provide 1'' (25mm) minimum clearance at bottom of mirror for engaging locking screws and...
Description	MIRROR WITH STAINLESS STEEL CHANNEL FRAME AND SHELF
File Size	82.38K / 2 Page	View it Online	Download Datasheet

				VICOR[Vicor Corporation]
Part No.	B048K030T21 B048K030M21
OCR Text	...rough bulk solder or copper pad lift-off vicorpower.com 800-735-6200 VI Chip Bus Converter Module B048K030T21 Rev. 1.0 Page 6 of 15 PRELIMINARY Pin/Control Functions +IN/-IN - DC Voltage Input Ports The VI Chip input ...
Description	VI Chip - BCM Bus Converter Module
File Size	562.83K / 15 Page	View it Online	Download Datasheet

For lift Found Datasheets File :: 630 Search Time::4.922ms
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