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For pads Found Datasheets File :: 17838 Search Time::4.515ms
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				Vishay Siliconix
Part No.	KBU4J-E4_51 KBU4K KBU4J-E4/51
OCR Text	... 0.5 x 0.5" (12 x 12 mm) copper pads and 0.375" (9.5 mm) lead length Document Number: 88656 Revision: 15-Apr-08 For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay....
Description	Single-Phase Bridge Rectifier
File Size	96.18K / 4 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	ISP1563BM ISP1563
OCR Text	...y supply voltage; used to power pads; add a 100 nF decoupling capacitor legacy gate 20 output; when not in use, pull-down to ground through a 10 k resistor 3.3 V output pad; 3 ns slew rate control; CMOS; open-drain KBIRQ1 8 I legacy keyboar...
Description	Hi-Speed USB PCI host controller
File Size	436.21K / 103 Page	View it Online	Download Datasheet

				MICREL[Micrel Semiconductor]
Part No.	MPD8021 MIC8021-0002 MIC8021-0001
OCR Text	...s, voltage references) * 67 I/O pads (36 include 2kV ESD protection) * Guaranteed -55C to +150C operation * Several package options * Low-cost prototyping program * Design support via Internet Applications * * * * * * * * * 2 and 3 moto...
Description	Semicustom High-Voltage Array Summary Information
File Size	36.72K / 2 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	PMA2-33LN-D PMA2-33LN-DF PMA2-33LN-DG PMA2-33LN-DP
OCR Text	...face passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. thermosonic bonding is used with minimized ultrasonic content. bond force, time, ultrasonic power and temperature are all critical param...
Description	Monolithic Amplifier Die
File Size	390.47K / 6 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	PMA2-153LN-D PMA2-153LN-DF PMA2-153LN-DG PMA2-153LN-DP
OCR Text	...face passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. thermosonic bonding is used with minimized ultrasonic content. bond force, time, ultrasonic power and temperature are all critic...
Description	Monolithic Amplifier Die
File Size	237.57K / 6 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	ISP1562BE ISP1562
OCR Text	...V supply voltage; used to power pads; add a 100 nF decoupling capacitor bit 30 of multiplexed PCI address and data PCI pad; 3.3 V signaling bit 29 of multiplexed PCI address and data PCI pad; 3.3 V signaling bit 28 of multiplexed PCI addres...
Description	Hi-Speed USB PCI host controller
File Size	405.37K / 94 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	GBL06-E3_45 GBL06-E3_51 GBL01 GBL04 GBL10 GBL06-E3/45 GBL06-E3/51 GBL08 GBL005
OCR Text	... 0.5 x 0.5" (12 x 12 mm) copper pads Document Number: 88609 Revision: 30-Apr-08 For technical questions within your region, please contact one of the following: PDD-Americas@vishay.com, PDD-Asia@vishay.com, PDD-Europe@vishay.com ww...
Description	Glass Passivated Single-Phase Bridge Rectifier
File Size	100.82K / 4 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	DF1510S
OCR Text	....51 x 0.51" (13 x 13 mm) copper pads SYMBOL DF15005S DF1501S DF1502S DF1504S DF1506S DF1508S DF1510S VRRM VRMS VDC IF(AV) IFSM I2t TJ, TSTG 50 35 50 100 70 100 200 140 200 400 280 400 1.5 50 10 - 55 to + 150 600 420 600 800 560 800 1000 700...
Description	Miniature Glass Passivated Single-Phase Surface Mount Bridge Rectifiers
File Size	88.06K / 4 Page	View it Online	Download Datasheet

				United Monolithic Semiconductors
Part No.	CHU3377
OCR Text	... Chip thickness = 100 +/- 10 RF pads (1, 5) = 90 x 110 (BCB opening) DC/IF pads = 100 x 100 (BCB opening) Pin number 1 2 3 4 Pin name IN -V +V OUT RF Input port Description Negative supply voltage port Positive supply voltage p...
Description	W-band Multifunction: Multiplier / MPA
File Size	180.11K / 6 Page	View it Online	Download Datasheet

For pads Found Datasheets File :: 17838 Search Time::4.515ms
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