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A3422EKA 05D12 75LS05 74HC24 N74F245D M1104 ER2002ST STK0105
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    TRIQUINT[TriQuint Semiconductor]
TriQuint Semiconductor,Inc.
Part No. TGA9088A-EPU TGA9088A
OCR Text ...itrogen atmosphere Component placement and adhesive attachment assembly notes: *= *= *= *= *= *= *= vacuum pencils and/or vacuum collets preferred method of pick up avoidance of air bridges during placement force impact critical during a...
Description 17 - 21 GHz Intermediate Power Amplifier
17-21 GHz Intermediate Power Amplifier

File Size 458.95K  /  4 Page

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    TGA4517-EPU

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TriQuint Semiconductor
Part No. TGA4517-EPU
OCR Text ...gen atmosphere. 0 Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description Ka-Band Power Amplifier

File Size 129.52K  /  10 Page

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    TGA1328-SCC

TriQuint Semiconductor
Part No. TGA1328-SCC
OCR Text ...trogen atmosphere. Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description DC-18GHz MPA with AGC

File Size 449.54K  /  10 Page

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    RF5125 RF5125PCBA-41X

RF Micro Devices
Part No. RF5125 RF5125PCBA-41X
OCR Text ...PCB layout is the selection and placement of output matching components (RF5125PCBA bill of materials (BOM) is available upon request). High-Q (quality factor) capacitors and inductors are not required in every RF5125 based design; however,...
Description 3V TO 5V, 2.4GHz TO 2.5GHz LINEAR POWER AMPLIFIER

File Size 257.88K  /  12 Page

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    PIC18F66J60 PIC18F66J65 PIC18F97J60T PIC18F67J60 PIC18F67J60T PIC18F86J60 PIC18F86J65 PIC18F87J60 PIC18F87J60T PIC18F96J

MICROCHIP[Microchip Technology]
Part No. PIC18F66J60 PIC18F66J65 PIC18F97J60T PIC18F67J60 PIC18F67J60T PIC18F86J60 PIC18F86J65 PIC18F87J60 PIC18F87J60T PIC18F96J60 PIC18F96J65 PIC18F97J60
OCR Text ...e. Note 1: 2: The ECCP2/P2A pin placement depends on the CCP2MX Configuration bit setting. P1B, P1C, P3B and P3C pin placement depends on the ECCPMX Configuration bit setting. (c) 2006 Microchip Technology Inc. Advance Information ...
Description 64/80/100-Pin, High-Performance, 1 Mbit Flash Microcontrollers with Ethernet

File Size 4,286.41K  /  474 Page

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    TGA1152-SCC

TriQuint Semiconductor
Part No. TGA1152-SCC
OCR Text ...trogen atmosphere. Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is crit...
Description 13.75 - 15 GHz 2 Watt Power Amplifier

File Size 545.09K  /  7 Page

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    IQS132

List of Unclassifed Manufacturers
Part No. IQS132
OCR Text ...gure 5.1.1 top layer component placement figure 5.1.2 bottom layer component placement 4.2 board plugin pcb design for iqs132/33/43 modules figure 5.2.1 top layer component placement iq switch ? proxsense ? series co...
Description IQ Switch - ProxSenseTM Series

File Size 1,062.64K  /  7 Page

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