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SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
http://
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| Part No. |
K9F5616D0C-P K9F5608D0C-P K9F5616D0C-D K9F5616D0C-Y K9F5608D0C-D K9F5608D0C-Y K9F5616D0C-H K9F5608Q0C-D K9F5608Q0C-H
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| OCR Text |
...tial issue. 1.pin assignment of tbga dummy ball is changed. (before) dnu --> (after) n.c 2. add the rp vs tr ,tf & rp vs ibusy graph for ...256 + 8)bit x16bit automatic program and erase - page program - x8 device(k9f5608x0c) :... |
| Description |
TV 37C 37#16 PIN RECP
TV 37C 37#16 SKT RECP
32M的8位，16x 16位NAND闪存
32M x 8 Bit , 16M x 16 Bit NAND Flash Memory 32M的8位，16米x 16位NAND闪存
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TV07; Number of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight 32M的8位，16米x 16位NAND闪存
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| File Size |
692.99K /
42 Page |
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SAMSUNG SEMICONDUCTOR CO. LTD.
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| Part No. |
K9F6408U0C-V
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| OCR Text |
... trp(min.) : 30ns --> 25ns 1. tbga package is changed. - 9mmx11mm 63ball tbga ---> 6mmx8.5mm 48ball tbga 2. part number(tbga package pa...256)byte ? 528-byte page read operation - random access : 10 s(max.) - serial page access ... |
| Description |
8M x 8 Bit NAND Flash Memory
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| File Size |
685.31K /
30 Page |
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Vitesse Semiconductor Corporation.
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| Part No. |
VSC7226
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| OCR Text |
...mally enhanced ball grid array (tbga) ! maximum case temperature: 100?c applications: ! backplane interconnect for data communications requiring 20 gigabits duplex of throughput ! serial bus extension ! 10 gigabit ethernet xaui transceiver ... |
| Description |
(ns): 240 (@16.8MHz); Operating Frequency / Supply Voltage: 1.8 to 5.5V; Operating Ambient Temperature (°C): -20 to 85; Package Code: PRDP0064BA
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| File Size |
103.70K /
2 Page |
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Freescale Semiconductor
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| Part No. |
MPC8360E
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| OCR Text |
... ii pro processor revision 2.x tbga features, including a block diagram showing the major functional components. this device is a cost-ef...256 hdlc or transparent channels ? 128 ss7 channels ? almost any combination of subgroups can be mul... |
| Description |
(MPC8358E / MPC8360E) PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
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| File Size |
1,245.64K /
112 Page |
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Samsung Electronic
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| Part No. |
K9F1216U0A
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| OCR Text |
...liminary history initial issue. tbga(k9f12xxx0a-dcb0/dib0) size information is changed. (before) 9 x 11 /0.8mm pitch , width 1.0 mm (after...256 + 8)bit x16bit ? automatic program and erase - page program - x8 device(k9f1208u0a) ... |
| Description |
64M x 8 Bit , 32M x 16 Bit NAND Flash Memory
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| File Size |
961.69K /
45 Page |
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Samsung Electronic
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| Part No. |
K9F5616Q0B/K9F5616U0B
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| OCR Text |
...f56xxx0b-dcb0/dib0 63- ball tbga ( 9 x 11 /0.8mm pitch , width 1.0 mm) - k9f5608u0b-vcb0/vib0 48 - pin wsop i (12x17x0.7mm) ...256 bytes) 2nd half page register (=256 bytes) 64k pages (=2,048 blocks) 512 byte 8 bit 16 byte... |
| Description |
32M x 8 Bit / 16M x 16 Bit NAND Flash Memory Data Sheet
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| File Size |
722.10K /
33 Page |
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it Online |
Download Datasheet |
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Price and Availability
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