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Rochester Electronics LLC |
Part No. |
9004FM/B
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Description |
9004 - NAND Gate, 9004 Series
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10115859-004LF
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Description |
HPCE R/A REC 36P24S
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Tech specs |
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Official Product Page
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Molex, Inc. MOLEX INC
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Part No. |
19007-0032 19005-0001 19005-0015 19007-0029 19007-0008 19007-0004 19007-0009 19007-0035 19004-0005 19007-0020
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Description |
.187X.020 FIQD FLAG EXP. TAPED (BB-2224X 2 mm2, PUSH-ON TERMINAL Female Disconnect Solderless Terminal; Wire Size (AWG):18-22; Tab Width:0.250"; Insulator Color:Pink; Terminal Insulation:Nylon; Gender:Female 0.8 mm2, PUSH-ON TERMINAL .250X.032 FEM.FIQD COUPLER TP (C-2265T) 5 mm2, PUSH-ON TERMINAL CONN .187 FLAG INSUL 14-16AWG 2 mm2, PUSH-ON TERMINAL .250X.032 FIQD FLAG STRIP(AA-2220Z) RoHS Compliant: Yes 0.8 mm2, PUSH-ON TERMINAL CONN .250 FLAG INSUL 18-22AWG 0.8 mm2, PUSH-ON TERMINAL .187X.020 FIQD FLAG (AA-2222) 0.8 mm2, PUSH-ON TERMINAL .187X.032 FIQD FLAG (BB-2225) 2 mm2, PUSH-ON TERMINAL CONN .250 MALE INSUL 14-16AWG 2 mm2, TAB TERMINAL 190070020
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File Size |
75.19K /
1 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
91269-004LF
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Description |
Minitek® 2.00mm, Board to Board, Shrouded Header - Through Hole - Single row - 4 Positions - 2mm (0.079in) - Right Angle.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-414HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-434HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 34 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-454HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 54 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-418HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 18 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
90325-9004 0903259004
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Description |
1.27mm (.050) Pitch Picoflex庐 PF-50 Header, Vertical, Low Profile, 4 Circuits, Tin (Sn) Plating, Tube Packaging 1.27mm (.050) Pitch Picoflex? PF-50 Header, Vertical, Low Profile, 4 Circuits, Tin (Sn) Plating, Tube Packaging
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File Size |
120.07K /
3 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
87900-438HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 38 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
87900-458HLF
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Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 58 Positions, 2.54 mm Pitch, Vertical, 18.29 mm (0.72in) Mating, 3.05 mm (0.12in) Tail.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
71249-0043LF
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Description |
Card Bus Header, Top Mount, S/D(68Pins), VTB, Type 123, 3.3V, 4.3mm s/o
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Tech specs |
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Official Product Page
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Price and Availability
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