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  87759-4415 Datasheet PDF File

For 87759-4415 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

    87759-4065

Molex Electronics Ltd.
Part No. 87759-4065
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.27K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-156-40LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-3875

Molex Electronics Ltd.
Part No. 87759-3875
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 38 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs,

File Size 280.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-156-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1615

Molex Electronics Ltd.
Part No. 87759-1615
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 279.46K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-156-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-3214

Molex Electronics Ltd.
Part No. 87759-3214
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free

File Size 420.10K  /  8 Page

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Amphenol Communications Solutions

Part No. 75844-150-08LF
Description 75844-150-08LF-HDR STR DOUBLE ROW
Tech specs    

Official Product Page

    87759-3876

Molex Electronics Ltd.
Part No. 87759-3876
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Pick-and-Place Cap

File Size 355.72K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-150-12LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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Amphenol Communications Solutions

Part No. 75844-156-18LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 18 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-2474

Molex Electronics Ltd.
Part No. 87759-2474
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Pick-and-Place Cap, Tape and Reel Packaging

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 75844-150-34LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4664

Molex Electronics Ltd.
Part No. 87759-4664
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-

File Size 421.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 75844-158-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-4665

Molex Electronics Ltd.
Part No. 87759-4665
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 46 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Surface Mount, Vertical, 46 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating, without Press-fit Plastic Pegs

File Size 280.47K  /  6 Page

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Amphenol Communications Solutions

Part No. 68764-415HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 15 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87759-7634

Molex Electronics Ltd.
Part No. 87759-7634
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs

File Size 355.91K  /  6 Page

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Amphenol Communications Solutions

Part No. 75844-156-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87759-4415 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 | 15 |   

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