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  87834-0819 Datasheet PDF File

For 87834-0819 Found Datasheets File :: 133+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 |   

    87834-1811 0878341811

Molex Electronics Ltd.
Part No. 87834-1811 0878341811
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 18 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Analog Devices

Part No. 108190-HMC591LP5
Description HMC591LP5 Evaluation PCB
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878343495 87834-3495

Molex Electronics Ltd.
Part No. 0878343495 87834-3495
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.69K  /  3 Page

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Analog Devices

Part No. 108190-HMC487LP5
Description HMC487LP5 Evaluation PCB
Tech specs    

Official Product Page

    0878345045 87834-5045

Molex Electronics Ltd.
Part No. 0878345045 87834-5045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13渭m (5渭) Gold (Au) Selective Plating

File Size 120.74K  /  3 Page

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Renesas Electronics Corporation

Part No. RJK0819DSP-00#J0
Description Nch Dual Power Mosfet 80V 2.4A 175Mohm Sop8
Tech specs    

Official Product Page

    0878343492 87834-3492

Molex Electronics Ltd.
Part No. 0878343492 87834-3492
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows, with Pin 5 Voided

File Size 100.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-809081900LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 8 Positions
Tech specs    

Official Product Page

    0878343441 87834-3441

Molex Electronics Ltd.
Part No. 0878343441 87834-3441
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating

File Size 113.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 54112-811081900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0878340419 87834-0419

Molex Electronics Ltd.
Part No. 0878340419 87834-0419
Description 2.54mm Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded 4 Circuits, 0.13μm Gold (Au) Plating, Black, without PCBLocator, without End

File Size 115.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-112081950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0878343421 87834-3421

http://
Molex Electronics Ltd.
Part No. 0878343421 87834-3421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.52K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-F08-19LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 38 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    0878343419 87834-3419

Molex Electronics Ltd.
Part No. 0878343419 87834-3419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 57102-S08-19LF
Description Minitek® 2.00mm, Board/Wire to Board Connector, 2.00mm (0,079in), Unshrouded Vertical Header, Through Hole, Double Row, 38 Positions
Tech specs    

Official Product Page

    0878340841 87834-0841

Molex Electronics Ltd.
Part No. 0878340841 87834-0841
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 112.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 54202-T0819LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 38 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0878341017

Molex Electronics Ltd.
Part No. 0878341017
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, Gold (Au) Flash, Polyester Housing

File Size 104.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 54122-112081950RLF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 8 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 87834-0819 Found Datasheets File :: 133+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 |   

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