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  87834-3419 Datasheet PDF File

For 87834-3419 Found Datasheets File :: 134+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 |   

    0878341041 87834-1041

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Molex Electronics Ltd.
Part No. 0878341041 87834-1041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.01K  /  3 Page

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Amphenol Communications Solutions

Part No. 76383-419LF
Description Dubox® 2.54mm, Wire to Board Connector, Shrouded Right Angle Header, Through Hole, Double row , 38 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-0819 0878340819

Molex Electronics Ltd.
Part No. 87834-0819 0878340819
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 8 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCBLocator

File Size 115.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-12LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 12 Positions
Tech specs    

Official Product Page

    0878343411 87834-3411

Molex Electronics Ltd.
Part No. 0878343411 87834-3411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-72LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 72 Positions
Tech specs    

Official Product Page

    0878343417 87834-3417

Molex Electronics Ltd.
Part No. 0878343417 87834-3417
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, Gold (Au) Flash, Polyester Housing

File Size 105.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 68033-419HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
Tech specs    

Official Product Page

    0878343421 87834-3421

http://
Molex Electronics Ltd.
Part No. 0878343421 87834-3421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.52K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-20LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 20 Positions
Tech specs    

Official Product Page

    0878343441 87834-3441

Molex Electronics Ltd.
Part No. 0878343441 87834-3441
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating

File Size 113.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 59132-S34-19-092LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 38 Positions, 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    0878343492 87834-3492

Molex Electronics Ltd.
Part No. 0878343492 87834-3492
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows, with Pin 5 Voided

File Size 100.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-08LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 08 Positions
Tech specs    

Official Product Page

    0878343495 87834-3495

Molex Electronics Ltd.
Part No. 0878343495 87834-3495
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.69K  /  3 Page

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Amphenol Communications Solutions

Part No. 77313-419-10LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 10 Positions
Tech specs    

Official Product Page

    0878345045 87834-5045

Molex Electronics Ltd.
Part No. 0878345045 87834-5045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 50 Circuits, 0.13渭m (5渭) Gold (Au) Selective Plating

File Size 120.74K  /  3 Page

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Amphenol Communications Solutions

Part No. 68683-419LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 38 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0878342621 87834-2621

Molex Electronics Ltd.
Part No. 0878342621 87834-2621
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating
MOLEX Connector

File Size 124.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 69173-419HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 7.49 mm (0.295 in.) Mating, 3.42 mm (0.135 in.) Tail
Tech specs    

Official Product Page

For 87834-3419 Found Datasheets File :: 134+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 | 14 |   

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