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  87914-4616 Datasheet PDF File

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    VG4616321BQ-6 VG4616321BQ-5R VG4616321BQ-7 VG4616321BQ-6R VG4616321BQ-7R

Vanguard International Semiconductor
Part No. VG4616321BQ-6 VG4616321BQ-5R VG4616321BQ-7 VG4616321BQ-6R VG4616321BQ-7R
Description 262,144x32x2-Bit CMOS Synchronous Graphic RAM

File Size 1,376.43K  /  82 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015246163 15-24-6163 42404-16B5

Molex Electronics Ltd.
Part No. 0015246163 15-24-6163 42404-16B5
Description 4.20mm (.165) Pitch Mini-Fit BMI Header, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, PA Polyamide Nylon 6/6 94V-0

File Size 314.74K  /  5 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

   
Part No. MSM54V24616
Description From old datasheet system

File Size 509.24K  /  32 Page

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Amphenol Communications Solutions

Part No. 77311-146-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    LTM4616IV-PBF LTM4616EV-PBF LTM4616V

Linear Technology
Part No. LTM4616IV-PBF LTM4616EV-PBF LTM4616V
Description Dual 8A per Channel Low VIN DC/DC μModule

File Size 311.08K  /  24 Page

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Amphenol Communications Solutions

Part No. 77311-846-16LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    LTM4616 LTM4616EV-PBF LTM4616IV-PBF LTM4616V

Linear Technology
Part No. LTM4616 LTM4616EV-PBF LTM4616IV-PBF LTM4616V
Description Dual 8A per Channel Low VIN DC/DC レModule

File Size 306.34K  /  24 Page

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Amphenol Communications Solutions

Part No. 131-4616-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    3M ELECTRONIC PRODUCTS DIVISION
Part No. 4630-7301 4610-6000 4640-7300 4610-7000 4614-6001 4616-6301 2340-5211TG 3431-6205 4624-6000
Description 30 CONTACT(S), MALE, TWO PART BOARD CONNECTOR, IDC, PLUG
10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR
40 CONTACT(S), MALE, TWO PART BOARD CONNECTOR, IDC, PLUG
10 CONTACT(S), MALE, TWO PART BOARD CONNECTOR, IDC, PLUG
14 CONTACT(S), MALE, TWO PART BOARD CONNECTOR, IDC, PLUG
16 CONTACT(S), MALE, TWO PART BOARD CONNECTOR, IDC, PLUG
40 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER
34 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, WIRE WRAP
24 CONTACT(S), MALE, TWO PART BOARD CONNECTOR, IDC, PLUG

File Size 1,494.70K  /  22 Page

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Amphenol Communications Solutions

Part No. 77313-846-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 16 Positions
Tech specs    

Official Product Page

    Linear Technology, Corp.
Part No. LTM4616EVPBF
Description Dual 8A per Channel Low VIN DC/DC &#181;Module; Package: LGA; No of Pins: 144; Temperature Range: -40&deg;C to 125&deg;C 8 A DUAL SWITCHING CONTROLLER, 1750 kHz SWITCHING FREQ-MAX, PBGA144

File Size 434.48K  /  28 Page

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Amphenol Communications Solutions

Part No. 131-4616-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    UPD4616112F9-BC90-BC2-A

Infineon Technologies AG
Part No. UPD4616112F9-BC90-BC2-A
Description 1M X 16 APPLICATION SPECIFIC SRAM, 90 ns, PBGA48 6 X 8 MM, FBGA-48

File Size 297.34K  /  36 Page

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Amphenol Communications Solutions

Part No. 10132446-16LF
Description Minitek® Pwr 3.0 HCC, Plug Housing, 16 Positions, Black Color, GW Compatible.
Tech specs    

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    Epson (China) Co., Ltd.
Part No. UPD4616112F9-BC10-BC2
Description x16 Pseudo-Static RAM x16伪静态存储器

File Size 211.27K  /  32 Page

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Amphenol Communications Solutions

Part No. 131-4616-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    UPD4616112F9-BC80-BC2 UPD4616112F9-BC90-BC2

NEC, Corp.
Infineon Technologies AG
NEC Corp.
Part No. UPD4616112F9-BC80-BC2 UPD4616112F9-BC90-BC2
Description 16M-BIT CMOS MOBILE SPECIFIED RAM 1M-WORD BY 16-BIT 1,600位CMOS移动指明内存100万字6
1M X 16 APPLICATION SPECIFIC SRAM, 90 ns, PBGA48 6 X 8 MM, FBGA-48

File Size 222.52K  /  32 Page

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Amphenol Communications Solutions

Part No. DWRT200PM14616
Description COOLPOWER MEZZANINE
Tech specs    

Official Product Page

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