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For bondable Found Datasheets File :: 275 Search Time::3.125ms
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				http:// Microsemi Corporation
Part No.	MV34001 MV34002 MV34003 MV34004 MV34005 MV34006 MV34007 MV34008 MV34009 MV34010 MV31008 MV30010 MV30011 MV30012 MV30013 MV30014 MV30015 MV30016 MV30017 MV30018 MV30019 MV32009 MV31017 MV30007 MV31021 MV31022 MV31023 MV31024 MV31025 MV31020 MV31026 MV30001 MV30003 MV30004 MV30008 MV30020 MV31001 MV31005 MV31007 MV30006 MV30009 MV31004 MV31006 MV31009 MV31010 MV30002 MV30005 MV31002 MV31003 MV32010
OCR Text	...amma Values to 1.5 Available as bondable Chips and as Packaged Diodes Available in Chip-on-Board Packaging Custom Designs Available Applications Description Microsemi's GaAs hyperabrupt junction varactor diodes are fabrica...
Description	GaAs Varactor Diodes Hyperabrupt
File Size	190.83K / 4 Page	View it Online	Download Datasheet

				Anaren Microwave
Part No.	C3A110650R0K5K5
OCR Text	...l ? epoxy attach ? wire bondable ? tolerance 10% anaren high frequency chip resistor electrical specifications: room (25 oc) min. typ. max. resistance ( ? ) 45...
Description	Anaren High Frequency Chip Resist
File Size	192.25K / 3 Page	View it Online	Download Datasheet

				M/A-COM Technology Solu... M/A-COM Technology Solutions, Inc.
Part No.	MA40201 MA40202 MA40205 MA40207-276 MA40251 MA40252 MA40257 MA40257-276 MA40215-276 MA40064 MA40053 MA40220 MA40222 MA40070 MA40108 MA40261 MA40264 MA40268 MA40272
OCR Text	... and axial lead packages and as bondable chips. Both P and N type diodes are offered. Applications Detectors and power monitors in stripline, coaxial and waveguide circuits through 40 GHz. 1 ADVANCED: Data Sheets contain information...
Description	Schottky Detector Diodes
File Size	109.11K / 5 Page	View it Online	Download Datasheet

				Skyworks Solutions Inc.
Part No.	SMV2019-000 SMV2019-203 SMV2019-210 SMV2019-219 SMV2019-240 SMV20191 SMV2020 SMV2020-000 SMV2020-203 SMV2020-210 SMV2020-219 SMV2020-240 SMV2021-000 SMV2022-000 SMV2022-210 SMV2022-219 SMV2022-240 SMV2023-240 SMV2021-210 SMV2021-240 SMV2021-203 SMV2022-203 SMV2023-000
OCR Text	bondable Planar Chips Applications l Voltage controlled oscillators Features High Q for low loss resonators Low leakage current l High tuning ratio for wideband VCOs l SPICE model parameters l Small footprint chip design l Lead (Pb...
Description	Silicon Hyperabrupt Junction Varactors, Packaged and bondable Planar Chips
File Size	443.33K / 5 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKR5 SKR3
OCR Text	...ions Values 3,5 x 3,5 12,25 bondable (Al) solderable (Ag/Ni) Al, diameter 500 m wafer frame 1229 Unit mm mm2 pcs SKR (c) by SEMIKRON Rev. 0 - 22.09.2009 1 SKR 3,5 Qu bond This technical information specifies semiconduct...
Description	DIODE
File Size	62.21K / 2 Page	View it Online	Download Datasheet

				AVX Corporation AVX, Corp.
Part No.	GX02YD104KAT500 GX02YD104KA7500 GX02YD104KA71000 GX02YD104KA72 GX02YD104KAT1000 GX02YD104KAT2 GX02ZZ104MAT2-1000 GX02ZZ104MA72-1000
OCR Text	...t. Au terminated units are wire bondable. Users may, therefore, find these devices equally useful in bypass applications when wire bonding is a necessary part of the manufacturing process. More information can be obtained by contacting the ...
Description	Ultra Broad Band Capacitor CAPACITOR, CERAMIC, 10 V, X7S, 0.1 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
File Size	167.31K / 2 Page	View it Online	Download Datasheet

				VISHAY ELECTRO-FILMS Vishay Siliconix
Part No.	PSC PSCS/T140BK PSCS/T140AM PSCS/T140BJ PSCS/T140BL PSCS/T140AK PSCS/T140AJ PSCS/T140AL PSCS/T1400J PSCS/T1400K PSCS/T1400L PSCS/T1400M PSCS/T1401J PSCS/T1401K PSCS/T1401L PSCS/T1401M PSCS/T140BM PSCS_T1400J PSCS_T1400K PSCS_T1400L PSCS_T1400M PSCS_T1401J PSCS_T1401K PSCS_T1401L PSCS_T1401M PSCS_T140AJ PSCS_T140AK PSCS_T140AL PSCS_T140AM PSCS_T140BJ PSCS_T140BK PSCS_T140BL PSCS_T140BM PSCT140BL
OCR Text	bondable Product may not be to scale * Small chip size: 0.050 inches square * Alumina substrate * Inductance up to 150 nH * Inductor material: Thin film gold The PSC Chip Inductors offer the best combination of size and value availab...
Description	1 ELEMENT, 0.14 uH, ALUMINA-CORE, GENERAL PURPOSE INDUCTOR, SMD Spiral Chip Inductor
File Size	125.98K / 3 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MA4M3050 MA4M2020 MA4M2300 MA4M3150 MA4M3030 MA4M1050 MA4M1100 MA4M3010
OCR Text	...s are used to provide an easily bondable metal pad on the capacitor chip. M/A-Com MNS capacitors have shown no measurable capacitance change when subjected to the rated standoff voltage at 150 Degrees C. The MA4M series of chip capacitors i...
Description	MNS Microwave Chip Capacitors
File Size	119.41K / 4 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7202-A2
OCR Text	...63 mm 2 2 WIRE BONDING The bondable area is 100 x 100 m for the EPI pad and 100 x 285 m for the other pads. The location of the bonding pads is close to the top Pyrex glass edge reducing the possible size and angle of the bonding capil...
Description	PRESSURE SENSOR DIE (0-2 BAR) FOR HARSH ENVIRONMENT
File Size	196.91K / 5 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKR509
OCR Text	...ions Values 5,6 x 5,6 31,36 bondable (Al) solderable (Ag/Ni) Al, diameter 500 m wafer frame 470 Unit mm mm2 pcs SKR (c) by SEMIKRON Rev. 0 - 22.09.2009 1 SKR 5,6 Qu bond This technical information specifies semiconducto...
Description	DIODE
File Size	71.05K / 2 Page	View it Online	Download Datasheet

For bondable Found Datasheets File :: 275 Search Time::3.125ms
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