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GENNUM[Gennum Corporation]
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Part No. |
GS9078ACNE3 GS9078A
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OCR Text |
...ntrol resistor. No Connect. Not bonded internally. Most positive power supply connection. Connect to +3.3V. Serial digital differential output. Connect to most negative power supply plane following the recommendations in Recommended PCB Foo... |
Description |
GS9078A HD-LINX-R II Multi-Rate Cable Driver
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File Size |
243.42K /
14 Page |
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Hittite Microwave Corpo... HITTITE[Hittite Microwave Corporation] 美国讯泰微波有限公司上海代表
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Part No. |
HMC362
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OCR Text |
...wer output, this port should be bonded to ground. For low power output, this port should be floating.
Handling Precautions
Follow these ...pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched wit... |
Description |
GaAs HBT MMIC DIVIDE-BY-4, DC - 11.0 GHz 600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
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File Size |
184.38K /
6 Page |
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it Online |
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HOLTEK[Holtek Semiconductor Inc]
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Part No. |
HTG1390 1390
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OCR Text |
...9 935.39
These pins must be bonded out for functional testing.
4
17th Nov '98
Preliminary
Pad Description
Pad No.
17, 18 8 9...pair R1,R0. However as R1,R0 can only store 8 bits, these instructions cannot fully specify the full... |
Description |
From old datasheet system 4-bit Microcontroller
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File Size |
423.31K /
27 Page |
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it Online |
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MACOM[Tyco Electronics]
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Part No. |
MASW4060G
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OCR Text |
... connected to each RFx port. If bonded to ground, it will cause the related port to be absorbative, or matched, in the isolated condition. A...pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers.
1.5
1.0
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Description |
GaAs SP4T Switch DC - 4.0 GHz
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File Size |
59.68K /
3 Page |
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it Online |
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IXYS, Corp. IXYS[IXYS Corporation]
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Part No. |
MCC122-18IO1 MCC122 MCC122-08IO1 MCC122-12IO1 MCC122-14IO1 MCC122-16IO1
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OCR Text |
...tandard package * Direct copper bonded Al2O3-ceramic base plate * Planar passivated chips * Isolation voltage 3600 V~ * UL registered, E 728...pair 4/5) UL Styles 1385, Type ZY 180R (R = right for pin pair 6/7) CSA Class 5851, File 41234
(c... |
Description |
Thyristor Module 300 A, 800 V, SCR From old datasheet system Thyristor and Rectifiers Modules
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File Size |
43.47K /
2 Page |
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it Online |
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IXYS[IXYS Corporation]
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Part No. |
MCD161-22IO1 MCC161 MCC161-20IO1 MCC161-22IO1 MCD161-20IO1
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OCR Text |
...tandard package * Direct Copper Bonded Al2O3-ceramic base plate * Planar passivated chips * Isolation voltage 3600 V~ * UL registered, E 728...pair 4/5) UL 758, style 1385, Type ZY 180R (R = right for pin pair 6/7) CSA class 5851, guide 460-1-... |
Description |
High Voltage Thyristor Module
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File Size |
87.63K /
3 Page |
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it Online |
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IXYS[IXYS Corporation]
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Part No. |
MCD94-22IO1B MCC94 MCC94-20IO1B MCC94-22IO1B MCD94-20IO1B
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OCR Text |
..., JEDEC TO-240 AA Direct Copper Bonded Al2O3 -ceramic base plate Planar passivated chips Isolation voltage 3600 V~ UL registered, E 72873 Ga...pair 4/5) UL 758, style 1385, Type ZY 200R (R = right for pin pair 6/7) CSA class 5851, guide 460-1-... |
Description |
Thyristor and Rectifiers Modules High Voltage Thyristor Module High Voltage Thyristor/Diode Modules
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File Size |
51.98K /
2 Page |
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it Online |
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IXYS[IXYS Corporation]
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Part No. |
MCO450-22IO1 MCO450 MCO450-20IO1
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OCR Text |
...
q
q q q q
Direct copper bonded Al2O3 -ceramic with copper base plate Planar passivated chips Isolation voltage 3600 V~ UL applied Ke...pair 4/5) CSA class 5851, guide 460-1-1, appl. 41234
10
1 0.01 0.1 1 IG A 10
Dimensions in ... |
Description |
High Power Single Thyristor Module
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File Size |
64.85K /
4 Page |
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it Online |
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IXYS[IXYS Corporation]
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Part No. |
MCO500-18IO1 MCO500 MCO500-12IO1 MCO500-14IO1 MCO500-16IO1
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OCR Text |
... standard package Direct copper bonded Al2O3-ceramic with copper base plate Planar passivated chips Isolation voltage 3600 V~ UL registered ...pair 4/5) CSA class 5851, guide 460-1-1
10
1
Dimensions in mm (1 mm = 0.0394")
0.01
0... |
Description |
1800V high power thyristor module 1600V high power thyristor module 1400V high power thyristor module 1200V high power thyristor module High Power Thyristor Modules
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File Size |
59.19K /
4 Page |
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it Online |
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Mosel Vitelic Corp MOSEL[Mosel Vitelic, Corp] Mosel Vitelic, Corp.
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Part No. |
MSS0271
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OCR Text |
....
IN0 and IN1 They should be bonded to ground both regularly. While abnormal lot (pitch shifted) is encountered, special bonding could be...pair SP+ and SP-. Due to a sophisticated architecture, there demands no ramp up (or ramp down) to el... |
Description |
2.7 VOICE ROM Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection
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File Size |
60.19K /
12 Page |
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it Online |
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