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SPA560 MMBT390 EL6040 ADFC13 VS9MAUH MAX3580 21100 B3200
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  bumped Datasheet PDF File

For bumped Found Datasheets File :: 538    Search Time::0.859ms    
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    Hitachi,Ltd.
Part No. HCD66727A03BP HCD66727A04 HD66702R
OCR Text ...7a03 bare chip hcd66727a03bp au-bumped chip hd66727a04ta0l tcp 2.4v to 5.5v phs & pager fonts hcd66727a04 bare chip hcd66727a04bp au-bumped chip hd66727 4 lcd-ii family comparison item lcd-ii (hd44780u) hd66702r hd66710 hd66712u power sup...
Description Low-Power Dot-Matrix Liquid Crystal Display Controller/Driver with Key Scan Function 低功耗点阵液晶显示控制器/键扫描功能驱动程

File Size 505.06K  /  97 Page

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    Electronic Theatre Controls, Inc.
Part No. UC1602I
OCR Text ... pp: packaging gu: gold bumped, face up gd: gold bumped, face down f n : type n tcp film part number memory drivers mux rate supported versions uc1602i 65 x 102 65 com x 102 seg 1/65, 1/49 g ...
Description 65x102 Matrix LCD Controller-Driver

File Size 719.66K  /  38 Page

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    SL2S2102FUD SL2S2102FTB SL2S2002 SL2S2002FTB SL2S2002FUD

NXP Semiconductors N.V.
Part No. SL2S2102FUD SL2S2102FTB SL2S2002 SL2S2002FTB SL2S2002FUD
OCR Text ...r wafer XSON3 Description sawn, bumped wafer, 120 m, on film frame carrier, Ci between LA and LB = 23.5 pF (typical) sawn, bumped wafer, 120 m, on film frame carrier, Ci between LA and LB = 97 pF (typical) Version Type number plastic ext...
Description ICODE SLIX a product family of smart label ICs
ICODE SLIX SPECIALTY TELECOM CIRCUIT, PDSO3
ICODE SLIX SPECIALTY TELECOM CIRCUIT, UUC

File Size 87.48K  /  13 Page

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    IXEP2300 IXEP2300XB IXEP2300WB

IXYS Corporation
Part No. IXEP2300 IXEP2300XB IXEP2300WB
OCR Text ...art description ixep2300wb gold bumped die / wafer form ixep2300xb gold bumped die / waffle pack le v el translators & dri v ers data in v ersion & o v er w rite bidirectional shift registers h v o u t o[1:300] in v /, blank/ half tknl ck,...
Description 300-Output ePaper Gate Driver

File Size 234.43K  /  2 Page

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    Samsung Electronic
Part No. S6B0718
OCR Text ...up flow on page 48 to 51 Change bumped PAD size (modify figure 2 and table 1 on page 3) Change the PAD Center Coordinates of COM39 and COMS1. (modify table 2 on page 4) Change LCD power supply voltage (modify VOUT and V0 voltage on page1, 5...
Description 104 SEG / 81 COM DRIVER & CONTROLLER FOR STN LCD

File Size 703.04K  /  64 Page

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    UC1697V UC1697VGAA

List of Unclassifed Manufacturers
Part No. UC1697V UC1697VGAA
OCR Text ...7 ORDERING INFORMATION GOLD bumped DIE Part Number UC1697vGAA MTP Yes I2 C No Description Gold bumped die, with MTP function. General Notes APPLICATION INFORMATION For improved readability, the specification contains many applicatio...
Description 128 x 128RGB C-STN LCD Controller-Driver w/ 16-bit per RGB On-Chip SRAM

File Size 895.47K  /  77 Page

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    SL3S12031213 SL3S1203FTB0 SL3S1203FUF SL3S1213FTB0 SL3S1213FUF

NXP Semiconductors
Part No. SL3S12031213 SL3S1203FTB0 SL3S1203FUF SL3S1213FTB0 SL3S1213FUF
OCR Text ...0 Wafer Wafer XSON6 Description bumped G2iL die on sawn 8" wafer bumped G2iL+ die on sawn 8" wafer Version not applicable not applicable Type number G2iL, plastic extremely thin small outline SOT886F1 package; no leads; 6 terminals; body...
Description UCODE G2iL and G2iL

File Size 148.43K  /  22 Page

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    STV7733 STV7733/WPB3 STV7733/BMP

STMicroelectronics
Part No. STV7733 STV7733/WPB3 STV7733/BMP
OCR Text ...le. The STV7733 is available in bumped die form. bumped die can be assembled in either a TCP or COG module. Figure 1. Block diagram DIR /CS SCLK VDD s s s DBB1 DBB2 DBC1 DBC2 DBD1 DBD2 Shift register direction DBA1 DBA2 Data...
Description 320 output dot-matrix display driver

File Size 305.39K  /  28 Page

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