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moisture Datasheet PDF File

For moisture Found Datasheets File :: 30156 Search Time::1.282ms
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				Toshiba Semiconductor
Part No.	TK150F04K3
OCR Text	...2 2009-04-17 TK150F04K3 moisture-Proof Packing The TK150F04K3 is packed in a moisture-proof laminated aluminum bag. Precautions for Transportation and Storage (1) Avoid excessive vibration during transportation. (2) Do not toss or ...
Description	Swiching Regulator, DC-DC Converter Applications Motor Drive Applications
File Size	207.57K / 7 Page	View it Online	Download Datasheet

				Everlight Electronics Co., Ltd
Part No.	U17-215-R6C-AQ1R2B-3T
OCR Text	...entioned is 0.1mm ,Unit = mm moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No. :SZDSE-175-R05 http://www.everlight.com Prepared date:14-Apr-2006 ...
Description	0805 Package Chip LED (0.8mm Height)
File Size	158.56K / 10 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	VBPW34FAS VBPW34FASR
OCR Text	... 245 C Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Temperature (C) 200 max. 30 s 150 max. 120 s 100 50 0 0 50 ...
Description	Silicon PIN Photodiode
File Size	160.42K / 8 Page	View it Online	Download Datasheet

				NICHIA CORPORATION
Part No.	NLSL06S01A-E
OCR Text	...t (silica gel) are placed in a moisture-proof foil bag and then heat-sealed. * u?????`????`?y? the moisture proof foil bag is covered with bubble-wrap and the bubble wrap is placed in a cardboard box. * ?`????`?????`?????`????`??? extra...
Description	SPECIFICATIONS FOR WARM WHITE STANDARD LED
File Size	264.42K / 9 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	CGY2032BTS
OCR Text	...urface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to ...
Description	DECT 500 mW power amplifier(DECT 500 mW 功率放大
File Size	61.06K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors Philips Semiconductors
Part No.	CGY2032TS
OCR Text	...urface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to ...
Description	DECT 500 mW power amplifier
File Size	60.20K / 12 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	VBPW34S VBPW34SR
OCR Text	... 245 C Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. Temperature (C) 200 max. 30 s 150 max. 120 s 100 50 0 0 50 ...
Description	Silicon PIN Photodiode
File Size	183.45K / 8 Page	View it Online	Download Datasheet

				Everlight Electronics Co., Ltd
Part No.	15-21-B6C-YR1S2B2-2T
OCR Text	...mension is 0.1mm , Unit = mm moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No: SZDSE-151-B21 http://www.everlight.com Prepared date: 29-Apr-2008 ...
Description	1206 Package Chip LED(1.0mm Height)
File Size	217.60K / 10 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor Maxim Integrated Products
Part No.	MAX1546ETL
OCR Text	...ty Rating: I. Classification of moisture Sensitivity per JEDEC standard JESD22-112: 40-Pin QFN (6x6) Copper Solder Plate Silver-filled Epoxy Gold (1.3 mil dia.) Epoxy with silica filler # 05-9000-0383 Class UL94-V0 Level 1 IV. Die Inf...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	119.24K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX3801UGG
OCR Text	...ty Rating: I. Classification of moisture Sensitivity per JEDEC standard JESD22-A112: 24-Pin QFN Copper Solder Plate Silver-filled Epoxy Gold (1.2 mil dia.) Epoxy with silica filler Buildsheet # 05-7001-0520 Class UL94-V0 Level 1 IV. D...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	65.71K / 7 Page	View it Online	Download Datasheet

For moisture Found Datasheets File :: 30156 Search Time::1.282ms
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