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For particles Found Datasheets File :: 877 Search Time::2.219ms
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				Philips Semiconductors NXP Semiconductors
Part No.	UAA3592 UAA3592HN
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description	Wideband Code Division Multiple / Access Frequency Division Duplex / Power Amplifier Wideband code division multiple access frequency division duplex power amplifier
File Size	53.65K / 12 Page	View it Online	Download Datasheet

				NXP Semiconductors Integrated Circuit Solution Inc PHILIPS[Philips Semiconductors]
Part No.	74AUC1G02 74AUC1G02GV 74AUC1G02GW
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description	From old datasheet system 74AUC1G02 Single 2-input NOR gate
File Size	51.70K / 12 Page	View it Online	Download Datasheet

				Mitsubishi Electric Semiconductor
Part No.	RA60H1317M RA60H1317M-01 RA60H1317M-E01
OCR Text	...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description	135-175MHz 60W 12.5V MOBILE RADIO
File Size	57.64K / 9 Page	View it Online	Download Datasheet

				Philips Semiconductors
Part No.	TDA7021T
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description	FM radio circuit for MTS
File Size	137.29K / 13 Page	View it Online	Download Datasheet

				Philips
Part No.	TDA7088T
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; f...
Description	FM receiver circuit for battery
File Size	94.05K / 16 Page	View it Online	Download Datasheet

				Philips
Part No.	74HC7014
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. 74HC7014 Several techniques exist f...
Description	Hex non-inverting precision
File Size	51.56K / 9 Page	View it Online	Download Datasheet

				MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation
Part No.	RA07M1317M RA07M1317M-01 RA07M1317M-E01
OCR Text	...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description	135-175MHz 6.5W 7.2V 2 Stage Amp. For PORTABLE RADIO 135-175MHz 6.5W 7.2V, 2 Stage Amp. For PORTABLE RADIO 135-175MHz 6.5W 7.2V/ 2 Stage Amp. For PORTABLE RADIO GIGATRUE 550 CAT6 PATCH 6 FT, NON BOOT, PURPLE
File Size	61.92K / 9 Page	View it Online	Download Datasheet

				Mitsubishi Electric, Corp. MITSUBISHI[Mitsubishi Electric Semiconductor] Mitsubishi Electric Corporation Mitsubishi Electric Sem...
Part No.	RA08H1317 RA08H1317M RA08H1317M-01 RA08H1317M-E01
OCR Text	...a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A the...
Description	TV 2C 2#16 SKT RECP 135 - 175MHz瓦特12.5V便携移动通信 Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVP00; Number of Contacts:2; Connector Shell Size:11; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight 135-175MHz 8W 12.5V PORTABLE/MOBILE RADIO
File Size	49.96K / 9 Page	View it Online	Download Datasheet

				Sanyo Electric Co.,Ltd. Sanyo Semicon Device
Part No.	LA4445 1489
OCR Text	... foreign matter such as cutting particles shall exist between heat sink and radiator fin. When applying grease on the junction surface, it must be applied uniformly on the whole surface. 5. IC lead pins are soldered to the printed circuit b...
Description	From old datasheet system 5.5W 2-Channel AF Power Amplifier
File Size	209.91K / 7 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors] NXP Semiconductors N.V.
Part No.	74HC1G00 74HCT1G00 74HC1G00GW 74HC1G00GV 74HCT1G00GV 74HCT1G00GW
OCR Text	...te (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for ...
Description	74HC1G00; 74HCT1G00; 2-input NAND gate 2-input NAND gate 2输入与非
File Size	68.50K / 16 Page	View it Online	Download Datasheet

For particles Found Datasheets File :: 877 Search Time::2.219ms
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